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contributor authorHung-Lung Lee
contributor authorFrancis Su
contributor authorS. K. Chen
contributor authorShyang-Jye Chang
contributor authorSheng-Jye Hwang
date accessioned2017-05-09T00:09:53Z
date available2017-05-09T00:09:53Z
date copyrightJune, 2003
date issued2003
identifier issn1528-9044
identifier otherJEPAE4-26218#268_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128210
description abstractThis paper presents a methodology for TSOP II LOC packaging design. The design objectives are: 1) to optimize mold-flow balance, which in turn minimizes air traps, and 2) to minimize manufacturing variability, which implies optimal quality. A mold-flow simulation tool called C-MOLD is used to evaluate various design configurations. Taguchi’s robust design method is used for manufacturing variability considerations. The simulated results are verified with experimental flow patterns produced by means of “short shots.” In the nomenclature of the Taguchi method, mold-flow balance was chosen as quality characteristics and select a set of design parameters called control factors. The objectives are to find the levels of the control factors, which optimize the flow balance, and, at the same time, minimize the sensitivity of the variations of the control factors.
publisherThe American Society of Mechanical Engineers (ASME)
titleComputer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance
typeJournal Paper
journal volume125
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1569957
journal fristpage268
journal lastpage275
identifier eissn1043-7398
keywordsFlow (Dynamics)
keywordsDesign
keywordsDesign methodology
keywordsPackaging
keywordsTaguchi methods
keywordsManufacturing
keywordsComputer-aided design
keywordsSimulation
keywordsEquations AND Cavities
treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002
contenttypeFulltext


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