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    Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003::page 354
    Author:
    Sreekant V. J. Narumanchi
    ,
    Jayathi Y. Murthy
    ,
    Cristina H. Amon
    DOI: 10.1115/1.1572903
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this study, numerical investigations are performed to examine the influence of unsteady submerged dielectric liquid (HFE-8401HT) jets impinging on electronic chip surfaces. The problem considered here involves conjugate heat transfer. Two different jet inlet velocity waveforms are studied—step and sinusoidal—over the range of frequencies 0.03–4.0 Hz, with the Reynolds number, based on jet inlet width, of up to 100. Results for chip surface temperatures and average Nusselt numbers are presented for both velocity waveforms over the range of frequencies considered, and the trends are discussed. A lumped-capacitance analysis for the chip is presented in terms of nondimensional parameters. The chip temperatures obtained from the analysis are compared to results obtained numerically.
    keyword(s): Capacitance , Reynolds number , Jets , Frequency , Temperature , Heat transfer , Computer simulation AND Oscillations ,
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      Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/128195
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    contributor authorSreekant V. J. Narumanchi
    contributor authorJayathi Y. Murthy
    contributor authorCristina H. Amon
    date accessioned2017-05-09T00:09:52Z
    date available2017-05-09T00:09:52Z
    date copyrightSeptember, 2003
    date issued2003
    identifier issn1528-9044
    identifier otherJEPAE4-26221#354_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128195
    description abstractIn this study, numerical investigations are performed to examine the influence of unsteady submerged dielectric liquid (HFE-8401HT) jets impinging on electronic chip surfaces. The problem considered here involves conjugate heat transfer. Two different jet inlet velocity waveforms are studied—step and sinusoidal—over the range of frequencies 0.03–4.0 Hz, with the Reynolds number, based on jet inlet width, of up to 100. Results for chip surface temperatures and average Nusselt numbers are presented for both velocity waveforms over the range of frequencies considered, and the trends are discussed. A lumped-capacitance analysis for the chip is presented in terms of nondimensional parameters. The chip temperatures obtained from the analysis are compared to results obtained numerically.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleInfluence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena
    typeJournal Paper
    journal volume125
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1572903
    journal fristpage354
    journal lastpage361
    identifier eissn1043-7398
    keywordsCapacitance
    keywordsReynolds number
    keywordsJets
    keywordsFrequency
    keywordsTemperature
    keywordsHeat transfer
    keywordsComputer simulation AND Oscillations
    treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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