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contributor authorSreekant V. J. Narumanchi
contributor authorJayathi Y. Murthy
contributor authorCristina H. Amon
date accessioned2017-05-09T00:09:52Z
date available2017-05-09T00:09:52Z
date copyrightSeptember, 2003
date issued2003
identifier issn1528-9044
identifier otherJEPAE4-26221#354_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128195
description abstractIn this study, numerical investigations are performed to examine the influence of unsteady submerged dielectric liquid (HFE-8401HT) jets impinging on electronic chip surfaces. The problem considered here involves conjugate heat transfer. Two different jet inlet velocity waveforms are studied—step and sinusoidal—over the range of frequencies 0.03–4.0 Hz, with the Reynolds number, based on jet inlet width, of up to 100. Results for chip surface temperatures and average Nusselt numbers are presented for both velocity waveforms over the range of frequencies considered, and the trends are discussed. A lumped-capacitance analysis for the chip is presented in terms of nondimensional parameters. The chip temperatures obtained from the analysis are compared to results obtained numerically.
publisherThe American Society of Mechanical Engineers (ASME)
titleInfluence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena
typeJournal Paper
journal volume125
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1572903
journal fristpage354
journal lastpage361
identifier eissn1043-7398
keywordsCapacitance
keywordsReynolds number
keywordsJets
keywordsFrequency
keywordsTemperature
keywordsHeat transfer
keywordsComputer simulation AND Oscillations
treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003
contenttypeFulltext


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