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    The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003::page 164
    Author:
    H. B. Ma
    ,
    G. P. Peterson
    DOI: 10.1115/1.1478058
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An extensive numerical analysis of the temperature distribution and fluid flow in a heat sink currently being used for cooling desktop computers was conducted, and demonstrated that if the base of a heat sink was fabricated as a heat pipe instead of a solid material, the heat transfer performance could be significantly increased. It was shown that as the heat sink length increases, the effect of the thermal conductivity of the base on the heat transfer performance increases to be a predictable limit. As the thermal conductivity is increased, the heat transfer performance of heat sinks is enhanced, but cannot exceed this limit. When the thermal conductivity increases to 2,370 W/m-K, the heat transfer performance of the heat sinks will be very close to the heat transfer performance obtained assuming a base with infinite thermal conductivity. Further increases in the thermal conductivity would not significantly improve the heat transfer performance of the heat sinks.
    keyword(s): Heat transfer , Thermal conductivity , Heat sinks , Cooling , Computers AND Temperature distribution ,
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      The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/126604
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    contributor authorH. B. Ma
    contributor authorG. P. Peterson
    date accessioned2017-05-09T00:07:10Z
    date available2017-05-09T00:07:10Z
    date copyrightSeptember, 2002
    date issued2002
    identifier issn1528-9044
    identifier otherJEPAE4-26206#164_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/126604
    description abstractAn extensive numerical analysis of the temperature distribution and fluid flow in a heat sink currently being used for cooling desktop computers was conducted, and demonstrated that if the base of a heat sink was fabricated as a heat pipe instead of a solid material, the heat transfer performance could be significantly increased. It was shown that as the heat sink length increases, the effect of the thermal conductivity of the base on the heat transfer performance increases to be a predictable limit. As the thermal conductivity is increased, the heat transfer performance of heat sinks is enhanced, but cannot exceed this limit. When the thermal conductivity increases to 2,370 W/m-K, the heat transfer performance of the heat sinks will be very close to the heat transfer performance obtained assuming a base with infinite thermal conductivity. Further increases in the thermal conductivity would not significantly improve the heat transfer performance of the heat sinks.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThe Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink
    typeJournal Paper
    journal volume124
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1478058
    journal fristpage164
    journal lastpage169
    identifier eissn1043-7398
    keywordsHeat transfer
    keywordsThermal conductivity
    keywordsHeat sinks
    keywordsCooling
    keywordsComputers AND Temperature distribution
    treeJournal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian