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contributor authorH. B. Ma
contributor authorG. P. Peterson
date accessioned2017-05-09T00:07:10Z
date available2017-05-09T00:07:10Z
date copyrightSeptember, 2002
date issued2002
identifier issn1528-9044
identifier otherJEPAE4-26206#164_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/126604
description abstractAn extensive numerical analysis of the temperature distribution and fluid flow in a heat sink currently being used for cooling desktop computers was conducted, and demonstrated that if the base of a heat sink was fabricated as a heat pipe instead of a solid material, the heat transfer performance could be significantly increased. It was shown that as the heat sink length increases, the effect of the thermal conductivity of the base on the heat transfer performance increases to be a predictable limit. As the thermal conductivity is increased, the heat transfer performance of heat sinks is enhanced, but cannot exceed this limit. When the thermal conductivity increases to 2,370 W/m-K, the heat transfer performance of the heat sinks will be very close to the heat transfer performance obtained assuming a base with infinite thermal conductivity. Further increases in the thermal conductivity would not significantly improve the heat transfer performance of the heat sinks.
publisherThe American Society of Mechanical Engineers (ASME)
titleThe Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink
typeJournal Paper
journal volume124
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1478058
journal fristpage164
journal lastpage169
identifier eissn1043-7398
keywordsHeat transfer
keywordsThermal conductivity
keywordsHeat sinks
keywordsCooling
keywordsComputers AND Temperature distribution
treeJournal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003
contenttypeFulltext


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