Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

Abstract

This paper illustrates the micromechanics approach to cyclic creep-fatigue damage of Pb-Sn, developed by the authors with the help of a simple case study. It is demonstrated that durability predictions can be made based solely on monotonic test data. Various parametric studies of practical interest are conducted to obtain mechanistic insights into various aspects of damage in solders e.g., effect of hydrostatic stresses, grain size, ramp rate, etc.