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    Optical Measurements of Shrinkage in UV-Cured Adhesives

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004::page 352
    Author:
    A. J. Hudson
    ,
    J. K. Spelt
    ,
    S. C. Martin
    ,
    M. Hubert
    DOI: 10.1115/1.1498264
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper describes an optical method that has been developed to accurately measure shrinkage during the cure of adhesives treated with UV light. The experiment was designed to measure changes in the volume of very small quantities of material appropriate to uses in the fiber-optic and micro-electronic industries. A spot-curing device (EFOS Inc.) was used to deliver a controlled exposure of UV-light with a known distribution of wavelengths to the sample. The results indicate that reproducible values for the volumetric shrinkage can be achieved using spot-curing methods. The technique described in this paper, combined with other experimental measurements under development, will assist in the selection of the appropriate adhesive for specific applications and the curing conditions needed to optimize its final properties.
    keyword(s): Ultraviolet radiation , Adhesives , Ultraviolet cured adhesives , Shrinkage (Materials) , Curing , Optical measurement , Wavelength , Fibers AND Measurement ,
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      Optical Measurements of Shrinkage in UV-Cured Adhesives

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/126581
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    contributor authorA. J. Hudson
    contributor authorJ. K. Spelt
    contributor authorS. C. Martin
    contributor authorM. Hubert
    date accessioned2017-05-09T00:07:09Z
    date available2017-05-09T00:07:09Z
    date copyrightDecember, 2002
    date issued2002
    identifier issn1528-9044
    identifier otherJEPAE4-26210#352_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/126581
    description abstractThis paper describes an optical method that has been developed to accurately measure shrinkage during the cure of adhesives treated with UV light. The experiment was designed to measure changes in the volume of very small quantities of material appropriate to uses in the fiber-optic and micro-electronic industries. A spot-curing device (EFOS Inc.) was used to deliver a controlled exposure of UV-light with a known distribution of wavelengths to the sample. The results indicate that reproducible values for the volumetric shrinkage can be achieved using spot-curing methods. The technique described in this paper, combined with other experimental measurements under development, will assist in the selection of the appropriate adhesive for specific applications and the curing conditions needed to optimize its final properties.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleOptical Measurements of Shrinkage in UV-Cured Adhesives
    typeJournal Paper
    journal volume124
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1498264
    journal fristpage352
    journal lastpage354
    identifier eissn1043-7398
    keywordsUltraviolet radiation
    keywordsAdhesives
    keywordsUltraviolet cured adhesives
    keywordsShrinkage (Materials)
    keywordsCuring
    keywordsOptical measurement
    keywordsWavelength
    keywordsFibers AND Measurement
    treeJournal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian