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    Special Issue on Poly’2000, London

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004::page 317
    Author:
    Bernd Michel
    ,
    Guest Editor
    ,
    Poly’2000 Co-chair
    ,
    Kikuo Kishimoto
    ,
    Guest Editor
    ,
    Poly’2000 Co-chair
    DOI: 10.1115/1.1497626
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Experts from the Polymeric Materials community from four continents met in December, 2000 at the Third International Workshop, Poly’2000 in London. The Poly conference series is sponsored by ASME, IEEE-CPMT, SPE, SPIE, MRS, and IMAPS UK. Previous Poly Workshops were held in Paris (1998 and 1999).
    keyword(s): Workshops (Work spaces) , Reliability , Photonics AND Microelectronic devices ,
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      Special Issue on Poly’2000, London

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/126573
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    contributor authorBernd Michel
    contributor authorGuest Editor
    contributor authorPoly’2000 Co-chair
    contributor authorKikuo Kishimoto
    contributor authorGuest Editor
    contributor authorPoly’2000 Co-chair
    date accessioned2017-05-09T00:07:08Z
    date available2017-05-09T00:07:08Z
    date copyrightDecember, 2002
    date issued2002
    identifier issn1528-9044
    identifier otherJEPAE4-26210#317_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/126573
    description abstractExperts from the Polymeric Materials community from four continents met in December, 2000 at the Third International Workshop, Poly’2000 in London. The Poly conference series is sponsored by ASME, IEEE-CPMT, SPE, SPIE, MRS, and IMAPS UK. Previous Poly Workshops were held in Paris (1998 and 1999).
    publisherThe American Society of Mechanical Engineers (ASME)
    titleSpecial Issue on Poly’2000, London
    typeJournal Paper
    journal volume124
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1497626
    journal fristpage317
    identifier eissn1043-7398
    keywordsWorkshops (Work spaces)
    keywordsReliability
    keywordsPhotonics AND Microelectronic devices
    treeJournal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian