Special Issue on Poly’2000, LondonSource: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004::page 317Author:Bernd Michel
,
Guest Editor
,
Poly’2000 Co-chair
,
Kikuo Kishimoto
,
Guest Editor
,
Poly’2000 Co-chair
DOI: 10.1115/1.1497626Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experts from the Polymeric Materials community from four continents met in December, 2000 at the Third International Workshop, Poly’2000 in London. The Poly conference series is sponsored by ASME, IEEE-CPMT, SPE, SPIE, MRS, and IMAPS UK. Previous Poly Workshops were held in Paris (1998 and 1999).
keyword(s): Workshops (Work spaces) , Reliability , Photonics AND Microelectronic devices ,
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contributor author | Bernd Michel | |
contributor author | Guest Editor | |
contributor author | Poly’2000 Co-chair | |
contributor author | Kikuo Kishimoto | |
contributor author | Guest Editor | |
contributor author | Poly’2000 Co-chair | |
date accessioned | 2017-05-09T00:07:08Z | |
date available | 2017-05-09T00:07:08Z | |
date copyright | December, 2002 | |
date issued | 2002 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26210#317_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126573 | |
description abstract | Experts from the Polymeric Materials community from four continents met in December, 2000 at the Third International Workshop, Poly’2000 in London. The Poly conference series is sponsored by ASME, IEEE-CPMT, SPE, SPIE, MRS, and IMAPS UK. Previous Poly Workshops were held in Paris (1998 and 1999). | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Special Issue on Poly’2000, London | |
type | Journal Paper | |
journal volume | 124 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1497626 | |
journal fristpage | 317 | |
identifier eissn | 1043-7398 | |
keywords | Workshops (Work spaces) | |
keywords | Reliability | |
keywords | Photonics AND Microelectronic devices | |
tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004 | |
contenttype | Fulltext |