| contributor author | Bernd Michel | |
| contributor author | Guest Editor | |
| contributor author | Poly’2000 Co-chair | |
| contributor author | Kikuo Kishimoto | |
| contributor author | Guest Editor | |
| contributor author | Poly’2000 Co-chair | |
| date accessioned | 2017-05-09T00:07:08Z | |
| date available | 2017-05-09T00:07:08Z | |
| date copyright | December, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26210#317_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126573 | |
| description abstract | Experts from the Polymeric Materials community from four continents met in December, 2000 at the Third International Workshop, Poly’2000 in London. The Poly conference series is sponsored by ASME, IEEE-CPMT, SPE, SPIE, MRS, and IMAPS UK. Previous Poly Workshops were held in Paris (1998 and 1999). | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Special Issue on Poly’2000, London | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1497626 | |
| journal fristpage | 317 | |
| identifier eissn | 1043-7398 | |
| keywords | Workshops (Work spaces) | |
| keywords | Reliability | |
| keywords | Photonics AND Microelectronic devices | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004 | |
| contenttype | Fulltext | |
