contributor author | Zongrong Liu | |
contributor author | D. D. L. Chung | |
date accessioned | 2017-05-09T00:04:38Z | |
date available | 2017-05-09T00:04:38Z | |
date copyright | March, 2001 | |
date issued | 2001 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26189#64_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125066 | |
description abstract | Air-firable glass-free metal electrically conductive thick film pastes of different compositions were developed by using a titanium alloy component, and tin and zinc metal substitutes for glass frit used in traditional thick film pastes. The effect of different components on the electrical resistivity and bonding between the thick film and the alumina substrate was investigated. Thick films with low electrical resistivity and good bonding to the alumina substrate were obtained by using silver, zinc, tin, and TiCu alloy powders in the pastes. The addition of zinc at a small proportion (<0.5 wt.%) to a thick film paste enhanced the adhesion between the thick film and the alumina substrate with negligible increase in the electrical resistivity. The use of titanium alloy powder instead of pure titanium powder is preferred. Better composition distribution, and consequently, better wetting and bonding are expected by using active metal particles of a smaller size. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Development of Glass-Free Metal Electrically Conductive Thick Films | |
type | Journal Paper | |
journal volume | 123 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1329131 | |
journal fristpage | 64 | |
journal lastpage | 69 | |
identifier eissn | 1043-7398 | |
keywords | Metals | |
keywords | Glass | |
keywords | Thick films | |
keywords | Alloys | |
keywords | Silver | |
keywords | Bonding | |
keywords | Particulate matter AND Titanium | |
tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001 | |
contenttype | Fulltext | |