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    Development of Glass-Free Metal Electrically Conductive Thick Films

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001::page 64
    Author:
    Zongrong Liu
    ,
    D. D. L. Chung
    DOI: 10.1115/1.1329131
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Air-firable glass-free metal electrically conductive thick film pastes of different compositions were developed by using a titanium alloy component, and tin and zinc metal substitutes for glass frit used in traditional thick film pastes. The effect of different components on the electrical resistivity and bonding between the thick film and the alumina substrate was investigated. Thick films with low electrical resistivity and good bonding to the alumina substrate were obtained by using silver, zinc, tin, and TiCu alloy powders in the pastes. The addition of zinc at a small proportion (<0.5 wt.%) to a thick film paste enhanced the adhesion between the thick film and the alumina substrate with negligible increase in the electrical resistivity. The use of titanium alloy powder instead of pure titanium powder is preferred. Better composition distribution, and consequently, better wetting and bonding are expected by using active metal particles of a smaller size.
    keyword(s): Metals , Glass , Thick films , Alloys , Silver , Bonding , Particulate matter AND Titanium ,
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      Development of Glass-Free Metal Electrically Conductive Thick Films

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    http://yetl.yabesh.ir/yetl1/handle/yetl/125066
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    contributor authorZongrong Liu
    contributor authorD. D. L. Chung
    date accessioned2017-05-09T00:04:38Z
    date available2017-05-09T00:04:38Z
    date copyrightMarch, 2001
    date issued2001
    identifier issn1528-9044
    identifier otherJEPAE4-26189#64_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125066
    description abstractAir-firable glass-free metal electrically conductive thick film pastes of different compositions were developed by using a titanium alloy component, and tin and zinc metal substitutes for glass frit used in traditional thick film pastes. The effect of different components on the electrical resistivity and bonding between the thick film and the alumina substrate was investigated. Thick films with low electrical resistivity and good bonding to the alumina substrate were obtained by using silver, zinc, tin, and TiCu alloy powders in the pastes. The addition of zinc at a small proportion (<0.5 wt.%) to a thick film paste enhanced the adhesion between the thick film and the alumina substrate with negligible increase in the electrical resistivity. The use of titanium alloy powder instead of pure titanium powder is preferred. Better composition distribution, and consequently, better wetting and bonding are expected by using active metal particles of a smaller size.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDevelopment of Glass-Free Metal Electrically Conductive Thick Films
    typeJournal Paper
    journal volume123
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1329131
    journal fristpage64
    journal lastpage69
    identifier eissn1043-7398
    keywordsMetals
    keywordsGlass
    keywordsThick films
    keywordsAlloys
    keywordsSilver
    keywordsBonding
    keywordsParticulate matter AND Titanium
    treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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