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contributor authorZongrong Liu
contributor authorD. D. L. Chung
date accessioned2017-05-09T00:04:38Z
date available2017-05-09T00:04:38Z
date copyrightMarch, 2001
date issued2001
identifier issn1528-9044
identifier otherJEPAE4-26189#64_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125066
description abstractAir-firable glass-free metal electrically conductive thick film pastes of different compositions were developed by using a titanium alloy component, and tin and zinc metal substitutes for glass frit used in traditional thick film pastes. The effect of different components on the electrical resistivity and bonding between the thick film and the alumina substrate was investigated. Thick films with low electrical resistivity and good bonding to the alumina substrate were obtained by using silver, zinc, tin, and TiCu alloy powders in the pastes. The addition of zinc at a small proportion (<0.5 wt.%) to a thick film paste enhanced the adhesion between the thick film and the alumina substrate with negligible increase in the electrical resistivity. The use of titanium alloy powder instead of pure titanium powder is preferred. Better composition distribution, and consequently, better wetting and bonding are expected by using active metal particles of a smaller size.
publisherThe American Society of Mechanical Engineers (ASME)
titleDevelopment of Glass-Free Metal Electrically Conductive Thick Films
typeJournal Paper
journal volume123
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1329131
journal fristpage64
journal lastpage69
identifier eissn1043-7398
keywordsMetals
keywordsGlass
keywordsThick films
keywordsAlloys
keywordsSilver
keywordsBonding
keywordsParticulate matter AND Titanium
treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001
contenttypeFulltext


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