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    Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001::page 19
    Author:
    Chandra S. Desai
    ,
    Russell Whitenack
    DOI: 10.1115/1.1324675
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A number of models for thermomechanical stress analysis and fatigue failure of materials are reviewed and their capabilities and limitations are identified. The unified disturbed state concept (DSC) for constitutive modeling of materials and interfaces is presented and compared with other approaches. An approximate procedure based on the DSC is proposed for accelerated design-analysis and cyclic fatigue failure. Solutions of example problems using the DSC and associated computer (FE) procedures are included to illustrate its integrated and improved capabilities for analysis of stresses, strains, microcracking, fracture and fatigue failure, and reliability.
    keyword(s): Stress , Fracture (Process) , Cycles , Failure , Drops , Solders , Finite element analysis , Equations , Electronic packaging AND Design ,
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      Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging

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    http://yetl.yabesh.ir/yetl1/handle/yetl/125060
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    contributor authorChandra S. Desai
    contributor authorRussell Whitenack
    date accessioned2017-05-09T00:04:37Z
    date available2017-05-09T00:04:37Z
    date copyrightMarch, 2001
    date issued2001
    identifier issn1528-9044
    identifier otherJEPAE4-26189#19_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125060
    description abstractA number of models for thermomechanical stress analysis and fatigue failure of materials are reviewed and their capabilities and limitations are identified. The unified disturbed state concept (DSC) for constitutive modeling of materials and interfaces is presented and compared with other approaches. An approximate procedure based on the DSC is proposed for accelerated design-analysis and cyclic fatigue failure. Solutions of example problems using the DSC and associated computer (FE) procedures are included to illustrate its integrated and improved capabilities for analysis of stresses, strains, microcracking, fracture and fatigue failure, and reliability.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleReview of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging
    typeJournal Paper
    journal volume123
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1324675
    journal fristpage19
    journal lastpage33
    identifier eissn1043-7398
    keywordsStress
    keywordsFracture (Process)
    keywordsCycles
    keywordsFailure
    keywordsDrops
    keywordsSolders
    keywordsFinite element analysis
    keywordsEquations
    keywordsElectronic packaging AND Design
    treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian