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contributor authorChandra S. Desai
contributor authorRussell Whitenack
date accessioned2017-05-09T00:04:37Z
date available2017-05-09T00:04:37Z
date copyrightMarch, 2001
date issued2001
identifier issn1528-9044
identifier otherJEPAE4-26189#19_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125060
description abstractA number of models for thermomechanical stress analysis and fatigue failure of materials are reviewed and their capabilities and limitations are identified. The unified disturbed state concept (DSC) for constitutive modeling of materials and interfaces is presented and compared with other approaches. An approximate procedure based on the DSC is proposed for accelerated design-analysis and cyclic fatigue failure. Solutions of example problems using the DSC and associated computer (FE) procedures are included to illustrate its integrated and improved capabilities for analysis of stresses, strains, microcracking, fracture and fatigue failure, and reliability.
publisherThe American Society of Mechanical Engineers (ASME)
titleReview of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging
typeJournal Paper
journal volume123
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1324675
journal fristpage19
journal lastpage33
identifier eissn1043-7398
keywordsStress
keywordsFracture (Process)
keywordsCycles
keywordsFailure
keywordsDrops
keywordsSolders
keywordsFinite element analysis
keywordsEquations
keywordsElectronic packaging AND Design
treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001
contenttypeFulltext


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