contributor author | Yarom Polsky | |
contributor author | I. Charles Ume | |
date accessioned | 2017-05-09T00:04:37Z | |
date available | 2017-05-09T00:04:37Z | |
date copyright | March, 2001 | |
date issued | 2001 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26189#1_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125055 | |
description abstract | The influence of transverse shear strain in the lamination theory modeling of Printed Wiring Board (PWB) deflection due to support conditions was examined. The in-plane mechanical properties of the core materials of a commercial PWB were measured as a function of temperature. Classical laminated plate theory and first-order shear deformation theory solutions for the out-of-plane deflection of a bare board configuration with two opposite edges simply supported and the remaining edges free were obtained. The weight of the board was approximated as a distributed transverse load. The effect of material property decrease with temperature and FR-4 layer thickness were examined to compare first-order shear and plane strain assumptions for the predicted warpage. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards | |
type | Journal Paper | |
journal volume | 123 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1343111 | |
journal fristpage | 1 | |
journal lastpage | 5 | |
identifier eissn | 1043-7398 | |
keywords | Temperature | |
keywords | Stress | |
keywords | Shear (Mechanics) | |
keywords | Warping | |
keywords | Equations | |
keywords | Laminations | |
keywords | Plane strain | |
keywords | Thickness | |
keywords | Printed circuit boards | |
keywords | Shear deformation AND Deflection | |
tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001 | |
contenttype | Fulltext | |