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    Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001::page 1
    Author:
    Yarom Polsky
    ,
    I. Charles Ume
    DOI: 10.1115/1.1343111
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The influence of transverse shear strain in the lamination theory modeling of Printed Wiring Board (PWB) deflection due to support conditions was examined. The in-plane mechanical properties of the core materials of a commercial PWB were measured as a function of temperature. Classical laminated plate theory and first-order shear deformation theory solutions for the out-of-plane deflection of a bare board configuration with two opposite edges simply supported and the remaining edges free were obtained. The weight of the board was approximated as a distributed transverse load. The effect of material property decrease with temperature and FR-4 layer thickness were examined to compare first-order shear and plane strain assumptions for the predicted warpage.
    keyword(s): Temperature , Stress , Shear (Mechanics) , Warping , Equations , Laminations , Plane strain , Thickness , Printed circuit boards , Shear deformation AND Deflection ,
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      Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards

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    http://yetl.yabesh.ir/yetl1/handle/yetl/125055
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    contributor authorYarom Polsky
    contributor authorI. Charles Ume
    date accessioned2017-05-09T00:04:37Z
    date available2017-05-09T00:04:37Z
    date copyrightMarch, 2001
    date issued2001
    identifier issn1528-9044
    identifier otherJEPAE4-26189#1_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125055
    description abstractThe influence of transverse shear strain in the lamination theory modeling of Printed Wiring Board (PWB) deflection due to support conditions was examined. The in-plane mechanical properties of the core materials of a commercial PWB were measured as a function of temperature. Classical laminated plate theory and first-order shear deformation theory solutions for the out-of-plane deflection of a bare board configuration with two opposite edges simply supported and the remaining edges free were obtained. The weight of the board was approximated as a distributed transverse load. The effect of material property decrease with temperature and FR-4 layer thickness were examined to compare first-order shear and plane strain assumptions for the predicted warpage.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleComparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards
    typeJournal Paper
    journal volume123
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1343111
    journal fristpage1
    journal lastpage5
    identifier eissn1043-7398
    keywordsTemperature
    keywordsStress
    keywordsShear (Mechanics)
    keywordsWarping
    keywordsEquations
    keywordsLaminations
    keywordsPlane strain
    keywordsThickness
    keywordsPrinted circuit boards
    keywordsShear deformation AND Deflection
    treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian