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contributor authorYarom Polsky
contributor authorI. Charles Ume
date accessioned2017-05-09T00:04:37Z
date available2017-05-09T00:04:37Z
date copyrightMarch, 2001
date issued2001
identifier issn1528-9044
identifier otherJEPAE4-26189#1_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125055
description abstractThe influence of transverse shear strain in the lamination theory modeling of Printed Wiring Board (PWB) deflection due to support conditions was examined. The in-plane mechanical properties of the core materials of a commercial PWB were measured as a function of temperature. Classical laminated plate theory and first-order shear deformation theory solutions for the out-of-plane deflection of a bare board configuration with two opposite edges simply supported and the remaining edges free were obtained. The weight of the board was approximated as a distributed transverse load. The effect of material property decrease with temperature and FR-4 layer thickness were examined to compare first-order shear and plane strain assumptions for the predicted warpage.
publisherThe American Society of Mechanical Engineers (ASME)
titleComparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards
typeJournal Paper
journal volume123
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1343111
journal fristpage1
journal lastpage5
identifier eissn1043-7398
keywordsTemperature
keywordsStress
keywordsShear (Mechanics)
keywordsWarping
keywordsEquations
keywordsLaminations
keywordsPlane strain
keywordsThickness
keywordsPrinted circuit boards
keywordsShear deformation AND Deflection
treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001
contenttypeFulltext


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