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    Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003::page 225
    Author:
    J. Y. Chang
    ,
    C. W. Yu
    ,
    R. L. Webb
    DOI: 10.1115/1.1348012
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper reports the results of CFD analysis to cool the 30-W socketed CPU of a desktop computer with minimum air flow rate and minimum heat sink size. This was achieved using only the fan in the power supply for all air movement in the chassis. A duct was employed to direct the air flow over the CPU and then to the inlet air vents of the power supply. Use of this duct allowed more than 10°C reduction of the CPU case temperature, relative to an unducted design. The CFD analysis results were confirmed by experiment, and the predicted CPU case temperatures agreed within ±2.9°C of the experimental values for the ducted cases. This paper describes the methodology of CFD analysis for the heat sink/duct design, and describes experimental procedures to validate the predictions.
    keyword(s): Air flow , Computational fluid dynamics , Design , Modeling , Computers , Ducts , Heat sinks , Temperature , Flow (Dynamics) , Vents AND Computer simulation ,
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      Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling

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    http://yetl.yabesh.ir/yetl1/handle/yetl/125032
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    contributor authorJ. Y. Chang
    contributor authorC. W. Yu
    contributor authorR. L. Webb
    date accessioned2017-05-09T00:04:35Z
    date available2017-05-09T00:04:35Z
    date copyrightSeptember, 2001
    date issued2001
    identifier issn1528-9044
    identifier otherJEPAE4-26195#225_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125032
    description abstractThis paper reports the results of CFD analysis to cool the 30-W socketed CPU of a desktop computer with minimum air flow rate and minimum heat sink size. This was achieved using only the fan in the power supply for all air movement in the chassis. A duct was employed to direct the air flow over the CPU and then to the inlet air vents of the power supply. Use of this duct allowed more than 10°C reduction of the CPU case temperature, relative to an unducted design. The CFD analysis results were confirmed by experiment, and the predicted CPU case temperatures agreed within ±2.9°C of the experimental values for the ducted cases. This paper describes the methodology of CFD analysis for the heat sink/duct design, and describes experimental procedures to validate the predictions.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleIdentification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling
    typeJournal Paper
    journal volume123
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1348012
    journal fristpage225
    journal lastpage231
    identifier eissn1043-7398
    keywordsAir flow
    keywordsComputational fluid dynamics
    keywordsDesign
    keywordsModeling
    keywordsComputers
    keywordsDucts
    keywordsHeat sinks
    keywordsTemperature
    keywordsFlow (Dynamics)
    keywordsVents AND Computer simulation
    treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian