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contributor authorJ. Y. Chang
contributor authorC. W. Yu
contributor authorR. L. Webb
date accessioned2017-05-09T00:04:35Z
date available2017-05-09T00:04:35Z
date copyrightSeptember, 2001
date issued2001
identifier issn1528-9044
identifier otherJEPAE4-26195#225_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125032
description abstractThis paper reports the results of CFD analysis to cool the 30-W socketed CPU of a desktop computer with minimum air flow rate and minimum heat sink size. This was achieved using only the fan in the power supply for all air movement in the chassis. A duct was employed to direct the air flow over the CPU and then to the inlet air vents of the power supply. Use of this duct allowed more than 10°C reduction of the CPU case temperature, relative to an unducted design. The CFD analysis results were confirmed by experiment, and the predicted CPU case temperatures agreed within ±2.9°C of the experimental values for the ducted cases. This paper describes the methodology of CFD analysis for the heat sink/duct design, and describes experimental procedures to validate the predictions.
publisherThe American Society of Mechanical Engineers (ASME)
titleIdentification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling
typeJournal Paper
journal volume123
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1348012
journal fristpage225
journal lastpage231
identifier eissn1043-7398
keywordsAir flow
keywordsComputational fluid dynamics
keywordsDesign
keywordsModeling
keywordsComputers
keywordsDucts
keywordsHeat sinks
keywordsTemperature
keywordsFlow (Dynamics)
keywordsVents AND Computer simulation
treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003
contenttypeFulltext


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