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    Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004::page 331
    Author:
    K. N. Chiang
    ,
    C. W. Chang
    ,
    C. T. Lin
    DOI: 10.1115/1.1389847
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Development of flip-chip-on-glass (FCOG) assembly technology using anisotropic conductive adhesive/film (ACA/ACF) is currently underway to achieve fine pitch interconnections between driver IC and flat panel display. Conductive adhesives are characterized by fine-pitch capability and more environment compatibility. Anisotropic conductive adhesive/film (ACA/ACF) is composed of an adhesive resin and conductive particles, such as metallic or metal-coated polymer particles. In contrast to a solder type flip chip interconnection, the electric current passing through conductive particles becomes the dominant conduction paths. The interconnection between the particles and the conductive surfaces is constructed by the elastic/plastic deformation of conductive particles with contact pressure, which is maintained by tensile stress in the adhesive. Although loss of electric contact can occur when the adhesive expands or swells in the Z- axis direction, delamination and cracking can occur in the adhesive layer while the tensile stress is excessive. In addition to performing processing simulations as well as reliability modeling, this research investigates the contact force that is developed and relaxed within the interconnection during the process sequence by using nonlinear finite element simulations. Environmental effects, such as high temperature and thermal loading, are also discussed. Moreover, a parametric study is performed for process design. To improve performance and reliability, variables such as ACF materials, proper processing conditions are discussed as well. Furthermore, this study presents a novel method called equivalent spring method, capable of significantly reducing the analysis CPU time and make process modeling and contact analysis of the 3D ACA/ACF process possible.
    keyword(s): Force , Adhesives , Particulate matter , Manufacturing , Finite element analysis , Modeling , Springs , Mechanical behavior , Pressure , Flip-chip packages , Metals , Reliability , Solders AND Flip-chip ,
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      Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

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    http://yetl.yabesh.ir/yetl1/handle/yetl/125013
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    • Journal of Electronic Packaging

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    contributor authorK. N. Chiang
    contributor authorC. W. Chang
    contributor authorC. T. Lin
    date accessioned2017-05-09T00:04:34Z
    date available2017-05-09T00:04:34Z
    date copyrightDecember, 2001
    date issued2001
    identifier issn1528-9044
    identifier otherJEPAE4-26198#331_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125013
    description abstractDevelopment of flip-chip-on-glass (FCOG) assembly technology using anisotropic conductive adhesive/film (ACA/ACF) is currently underway to achieve fine pitch interconnections between driver IC and flat panel display. Conductive adhesives are characterized by fine-pitch capability and more environment compatibility. Anisotropic conductive adhesive/film (ACA/ACF) is composed of an adhesive resin and conductive particles, such as metallic or metal-coated polymer particles. In contrast to a solder type flip chip interconnection, the electric current passing through conductive particles becomes the dominant conduction paths. The interconnection between the particles and the conductive surfaces is constructed by the elastic/plastic deformation of conductive particles with contact pressure, which is maintained by tensile stress in the adhesive. Although loss of electric contact can occur when the adhesive expands or swells in the Z- axis direction, delamination and cracking can occur in the adhesive layer while the tensile stress is excessive. In addition to performing processing simulations as well as reliability modeling, this research investigates the contact force that is developed and relaxed within the interconnection during the process sequence by using nonlinear finite element simulations. Environmental effects, such as high temperature and thermal loading, are also discussed. Moreover, a parametric study is performed for process design. To improve performance and reliability, variables such as ACF materials, proper processing conditions are discussed as well. Furthermore, this study presents a novel method called equivalent spring method, capable of significantly reducing the analysis CPU time and make process modeling and contact analysis of the 3D ACA/ACF process possible.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleProcess Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages
    typeJournal Paper
    journal volume123
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1389847
    journal fristpage331
    journal lastpage337
    identifier eissn1043-7398
    keywordsForce
    keywordsAdhesives
    keywordsParticulate matter
    keywordsManufacturing
    keywordsFinite element analysis
    keywordsModeling
    keywordsSprings
    keywordsMechanical behavior
    keywordsPressure
    keywordsFlip-chip packages
    keywordsMetals
    keywordsReliability
    keywordsSolders AND Flip-chip
    treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian