| contributor author | Dickson T. S. Yeung | |
| contributor author | David C. C. Lam | |
| contributor author | Matthew M. F. Yuen | |
| date accessioned | 2017-05-09T00:02:13Z | |
| date available | 2017-05-09T00:02:13Z | |
| date copyright | March, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26178#67_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123580 | |
| description abstract | A four-layer center cracked beam (CCB) under four point bending loading is developed for the interfacial fracture properties measurement of electronics packaging materials. Determination of the mixed mode interfacial fracture properties along the second and third layers of the CCB specimen is carried out analytically. For a given test specimen, a stable test window (material combination and thickness ratio) has been identified using the analytical expression. Data yield from interfacial mixed mode fracture properties experimental measurement can be enhanced by testing within the testing window. [S1043-7398(00)00101-8] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.483137 | |
| journal fristpage | 67 | |
| journal lastpage | 72 | |
| identifier eissn | 1043-7398 | |
| keywords | Design | |
| keywords | Fracture (Process) | |
| keywords | Testing | |
| keywords | Electronic packages | |
| keywords | Stress | |
| keywords | Thickness AND Electronic packaging | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 001 | |
| contenttype | Fulltext | |