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contributor authorDickson T. S. Yeung
contributor authorDavid C. C. Lam
contributor authorMatthew M. F. Yuen
date accessioned2017-05-09T00:02:13Z
date available2017-05-09T00:02:13Z
date copyrightMarch, 2000
date issued2000
identifier issn1528-9044
identifier otherJEPAE4-26178#67_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/123580
description abstractA four-layer center cracked beam (CCB) under four point bending loading is developed for the interfacial fracture properties measurement of electronics packaging materials. Determination of the mixed mode interfacial fracture properties along the second and third layers of the CCB specimen is carried out analytically. For a given test specimen, a stable test window (material combination and thickness ratio) has been identified using the analytical expression. Data yield from interfacial mixed mode fracture properties experimental measurement can be enhanced by testing within the testing window. [S1043-7398(00)00101-8]
publisherThe American Society of Mechanical Engineers (ASME)
titleSpecimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages
typeJournal Paper
journal volume122
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.483137
journal fristpage67
journal lastpage72
identifier eissn1043-7398
keywordsDesign
keywordsFracture (Process)
keywordsTesting
keywordsElectronic packages
keywordsStress
keywordsThickness AND Electronic packaging
treeJournal of Electronic Packaging:;2000:;volume( 122 ):;issue: 001
contenttypeFulltext


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