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    A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

    Source: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 002::page 107
    Author:
    Sanjeev B. Sathe
    ,
    Bahgat G. Sammakia
    DOI: 10.1115/1.483141
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper deals with the thermal management of a TBGA chip carrier package. In TBGA packages the backside of the chip is available for heat sink or heat spreader (cover plate) attach. By attaching a heat sink directly to the chip and using a thin layer of high thermal conductivity adhesive, a very low internal thermal resistance can be achieved. The package is attached to an organic card and placed vertically in a channel. A three-dimensional conjugate heat transfer model is used, accounting for conduction and radiation in the package and card and convection in the surrounding air. A simplified turbulence model is developed to predict temperatures in the low Re turbulence regime. A parametric study is performed to evaluate the effects of card design, air velocities, interconnect thermal conductivities and thermal radiation on the chip junction temperatures. An experimental study was also conducted to verify the model. Even though the geometry is highly complex due to the multilayer construction of the module and the card, agreement between the model and the experimental measurement is excellent. It was shown that radiation heat transfer can be an equally significant mode as convection in the natural convection regime. [S1043-7398(00)01302-5]
    keyword(s): Heat , Temperature , Heat transfer , Velocity , Turbulence , Carding machines , Natural convection , Integrated circuits , Junctions , Flow (Dynamics) , Thermal conductivity , Radiation (Physics) , Channels (Hydraulic engineering) , Materials properties , Adhesives , Heat conduction , Modeling , Energy dissipation AND Boundary-value problems ,
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      A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

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    http://yetl.yabesh.ir/yetl1/handle/yetl/123554
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    contributor authorSanjeev B. Sathe
    contributor authorBahgat G. Sammakia
    date accessioned2017-05-09T00:02:12Z
    date available2017-05-09T00:02:12Z
    date copyrightJune, 2000
    date issued2000
    identifier issn1528-9044
    identifier otherJEPAE4-26181#107_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/123554
    description abstractThis paper deals with the thermal management of a TBGA chip carrier package. In TBGA packages the backside of the chip is available for heat sink or heat spreader (cover plate) attach. By attaching a heat sink directly to the chip and using a thin layer of high thermal conductivity adhesive, a very low internal thermal resistance can be achieved. The package is attached to an organic card and placed vertically in a channel. A three-dimensional conjugate heat transfer model is used, accounting for conduction and radiation in the package and card and convection in the surrounding air. A simplified turbulence model is developed to predict temperatures in the low Re turbulence regime. A parametric study is performed to evaluate the effects of card design, air velocities, interconnect thermal conductivities and thermal radiation on the chip junction temperatures. An experimental study was also conducted to verify the model. Even though the geometry is highly complex due to the multilayer construction of the module and the card, agreement between the model and the experimental measurement is excellent. It was shown that radiation heat transfer can be an equally significant mode as convection in the natural convection regime. [S1043-7398(00)01302-5]
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
    typeJournal Paper
    journal volume122
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.483141
    journal fristpage107
    journal lastpage114
    identifier eissn1043-7398
    keywordsHeat
    keywordsTemperature
    keywordsHeat transfer
    keywordsVelocity
    keywordsTurbulence
    keywordsCarding machines
    keywordsNatural convection
    keywordsIntegrated circuits
    keywordsJunctions
    keywordsFlow (Dynamics)
    keywordsThermal conductivity
    keywordsRadiation (Physics)
    keywordsChannels (Hydraulic engineering)
    keywordsMaterials properties
    keywordsAdhesives
    keywordsHeat conduction
    keywordsModeling
    keywordsEnergy dissipation AND Boundary-value problems
    treeJournal of Electronic Packaging:;2000:;volume( 122 ):;issue: 002
    contenttypeFulltext
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    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian