contributor author | Sanjeev B. Sathe | |
contributor author | Bahgat G. Sammakia | |
date accessioned | 2017-05-09T00:02:12Z | |
date available | 2017-05-09T00:02:12Z | |
date copyright | June, 2000 | |
date issued | 2000 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26181#107_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123554 | |
description abstract | This paper deals with the thermal management of a TBGA chip carrier package. In TBGA packages the backside of the chip is available for heat sink or heat spreader (cover plate) attach. By attaching a heat sink directly to the chip and using a thin layer of high thermal conductivity adhesive, a very low internal thermal resistance can be achieved. The package is attached to an organic card and placed vertically in a channel. A three-dimensional conjugate heat transfer model is used, accounting for conduction and radiation in the package and card and convection in the surrounding air. A simplified turbulence model is developed to predict temperatures in the low Re turbulence regime. A parametric study is performed to evaluate the effects of card design, air velocities, interconnect thermal conductivities and thermal radiation on the chip junction temperatures. An experimental study was also conducted to verify the model. Even though the geometry is highly complex due to the multilayer construction of the module and the card, agreement between the model and the experimental measurement is excellent. It was shown that radiation heat transfer can be an equally significant mode as convection in the natural convection regime. [S1043-7398(00)01302-5] | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package | |
type | Journal Paper | |
journal volume | 122 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.483141 | |
journal fristpage | 107 | |
journal lastpage | 114 | |
identifier eissn | 1043-7398 | |
keywords | Heat | |
keywords | Temperature | |
keywords | Heat transfer | |
keywords | Velocity | |
keywords | Turbulence | |
keywords | Carding machines | |
keywords | Natural convection | |
keywords | Integrated circuits | |
keywords | Junctions | |
keywords | Flow (Dynamics) | |
keywords | Thermal conductivity | |
keywords | Radiation (Physics) | |
keywords | Channels (Hydraulic engineering) | |
keywords | Materials properties | |
keywords | Adhesives | |
keywords | Heat conduction | |
keywords | Modeling | |
keywords | Energy dissipation AND Boundary-value problems | |
tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 002 | |
contenttype | Fulltext | |