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contributor authorSanjeev B. Sathe
contributor authorBahgat G. Sammakia
date accessioned2017-05-09T00:02:12Z
date available2017-05-09T00:02:12Z
date copyrightJune, 2000
date issued2000
identifier issn1528-9044
identifier otherJEPAE4-26181#107_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/123554
description abstractThis paper deals with the thermal management of a TBGA chip carrier package. In TBGA packages the backside of the chip is available for heat sink or heat spreader (cover plate) attach. By attaching a heat sink directly to the chip and using a thin layer of high thermal conductivity adhesive, a very low internal thermal resistance can be achieved. The package is attached to an organic card and placed vertically in a channel. A three-dimensional conjugate heat transfer model is used, accounting for conduction and radiation in the package and card and convection in the surrounding air. A simplified turbulence model is developed to predict temperatures in the low Re turbulence regime. A parametric study is performed to evaluate the effects of card design, air velocities, interconnect thermal conductivities and thermal radiation on the chip junction temperatures. An experimental study was also conducted to verify the model. Even though the geometry is highly complex due to the multilayer construction of the module and the card, agreement between the model and the experimental measurement is excellent. It was shown that radiation heat transfer can be an equally significant mode as convection in the natural convection regime. [S1043-7398(00)01302-5]
publisherThe American Society of Mechanical Engineers (ASME)
titleA Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
typeJournal Paper
journal volume122
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.483141
journal fristpage107
journal lastpage114
identifier eissn1043-7398
keywordsHeat
keywordsTemperature
keywordsHeat transfer
keywordsVelocity
keywordsTurbulence
keywordsCarding machines
keywordsNatural convection
keywordsIntegrated circuits
keywordsJunctions
keywordsFlow (Dynamics)
keywordsThermal conductivity
keywordsRadiation (Physics)
keywordsChannels (Hydraulic engineering)
keywordsMaterials properties
keywordsAdhesives
keywordsHeat conduction
keywordsModeling
keywordsEnergy dissipation AND Boundary-value problems
treeJournal of Electronic Packaging:;2000:;volume( 122 ):;issue: 002
contenttypeFulltext


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