| contributor author | C. Y. Hui | |
| contributor author | H. D. Conway | |
| contributor author | Y. Y. Lin | |
| date accessioned | 2017-05-09T00:02:11Z | |
| date available | 2017-05-09T00:02:11Z | |
| date copyright | September, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26184#267_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123547 | |
| description abstract | The residual stresses in thin films are explained using elementary mechanics. In particular, the range of validity of the well-known Stoney’s formula is examined using a strength of materials approach. An improved formula is obtained. The results of these analyses can also be used to compute energy release rates for cracks in thin film systems. Some simple examples of such applications are given. [S1043-7398(00)01603-0] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1287930 | |
| journal fristpage | 267 | |
| journal lastpage | 273 | |
| identifier eissn | 1043-7398 | |
| keywords | Composite materials | |
| keywords | Residual stresses | |
| keywords | Stress | |
| keywords | Formulas | |
| keywords | Thin films AND Deformation | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003 | |
| contenttype | Fulltext | |