contributor author | D. A. Hall | |
contributor author | G. C. Vliet | |
contributor author | T. L. Bergman | |
date accessioned | 2017-05-08T23:59:22Z | |
date available | 2017-05-08T23:59:22Z | |
date copyright | June, 1999 | |
date issued | 1999 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26173#75_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/122009 | |
description abstract | Temperature distributions on the surfaces of vertical channels formed by parallel plates heated uniformly and symmetrically and cooled by conduction, radiation, and natural convection in air are determined numerically and experimentally. Effects of wall separation, thickness, thermal conductivity, and emissivity on the wall temperature distribution are determined. Both cases of controlled and uncontrolled channel edge leading and exit edge temperatures are examined. Optimum channel widths and correlations for the maximum wall temperature rise are offered for both the controlled and uncontrolled edge temperature conditions. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Natural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction | |
type | Journal Paper | |
journal volume | 121 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792671 | |
journal fristpage | 75 | |
journal lastpage | 84 | |
identifier eissn | 1043-7398 | |
keywords | Channels (Hydraulic engineering) | |
keywords | Radiation (Physics) | |
keywords | Heat conduction | |
keywords | Natural convection | |
keywords | Cooling | |
keywords | Temperature | |
keywords | Wall temperature | |
keywords | Separation (Technology) | |
keywords | Plates (structures) | |
keywords | Temperature distribution | |
keywords | Thickness | |
keywords | Emissivity AND Thermal conductivity | |
tree | Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 002 | |
contenttype | Fulltext | |