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contributor authorD. A. Hall
contributor authorG. C. Vliet
contributor authorT. L. Bergman
date accessioned2017-05-08T23:59:22Z
date available2017-05-08T23:59:22Z
date copyrightJune, 1999
date issued1999
identifier issn1528-9044
identifier otherJEPAE4-26173#75_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/122009
description abstractTemperature distributions on the surfaces of vertical channels formed by parallel plates heated uniformly and symmetrically and cooled by conduction, radiation, and natural convection in air are determined numerically and experimentally. Effects of wall separation, thickness, thermal conductivity, and emissivity on the wall temperature distribution are determined. Both cases of controlled and uncontrolled channel edge leading and exit edge temperatures are examined. Optimum channel widths and correlations for the maximum wall temperature rise are offered for both the controlled and uncontrolled edge temperature conditions.
publisherThe American Society of Mechanical Engineers (ASME)
titleNatural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction
typeJournal Paper
journal volume121
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792671
journal fristpage75
journal lastpage84
identifier eissn1043-7398
keywordsChannels (Hydraulic engineering)
keywordsRadiation (Physics)
keywordsHeat conduction
keywordsNatural convection
keywordsCooling
keywordsTemperature
keywordsWall temperature
keywordsSeparation (Technology)
keywordsPlates (structures)
keywordsTemperature distribution
keywordsThickness
keywordsEmissivity AND Thermal conductivity
treeJournal of Electronic Packaging:;1999:;volume( 121 ):;issue: 002
contenttypeFulltext


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