YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 003::page 179
    Author:
    X. Q. Shi
    ,
    W. Zhou
    ,
    Z. P. Wang
    ,
    H. L. J. Pang
    DOI: 10.1115/1.2792681
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this study, tensile tests of 63Sn/37Pb solder were carried out at various strain rates from 10−5 s−1 to 10−1 s−1 over a wide temperature range from −40°C to 125°C to study the effect of strain rate and testing temperature on the mechanical properties in a systematic manner. Based on these experimental data, a set of empirical formulae was derived by a statistical method to describe the effect of temperature and strain rate in a quantitative manner and explain the variation in the mechanical properties published in other reports. It is concluded that the empirical formulae can be used to characterize the mechanical properties of 63Sn/37Pb over a wide range of temperatures and strain rates.
    keyword(s): Temperature , Alloys , Solders , Mechanical properties , Formulas AND Testing ,
    • Download: (1008.Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/121998
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorX. Q. Shi
    contributor authorW. Zhou
    contributor authorZ. P. Wang
    contributor authorH. L. J. Pang
    date accessioned2017-05-08T23:59:21Z
    date available2017-05-08T23:59:21Z
    date copyrightSeptember, 1999
    date issued1999
    identifier issn1528-9044
    identifier otherJEPAE4-26174#179_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/121998
    description abstractIn this study, tensile tests of 63Sn/37Pb solder were carried out at various strain rates from 10−5 s−1 to 10−1 s−1 over a wide temperature range from −40°C to 125°C to study the effect of strain rate and testing temperature on the mechanical properties in a systematic manner. Based on these experimental data, a set of empirical formulae was derived by a statistical method to describe the effect of temperature and strain rate in a quantitative manner and explain the variation in the mechanical properties published in other reports. It is concluded that the empirical formulae can be used to characterize the mechanical properties of 63Sn/37Pb over a wide range of temperatures and strain rates.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEffect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy
    typeJournal Paper
    journal volume121
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792681
    journal fristpage179
    journal lastpage185
    identifier eissn1043-7398
    keywordsTemperature
    keywordsAlloys
    keywordsSolders
    keywordsMechanical properties
    keywordsFormulas AND Testing
    treeJournal of Electronic Packaging:;1999:;volume( 121 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian