| contributor author | X. Q. Shi | |
| contributor author | W. Zhou | |
| contributor author | Z. P. Wang | |
| contributor author | H. L. J. Pang | |
| date accessioned | 2017-05-08T23:59:21Z | |
| date available | 2017-05-08T23:59:21Z | |
| date copyright | September, 1999 | |
| date issued | 1999 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26174#179_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/121998 | |
| description abstract | In this study, tensile tests of 63Sn/37Pb solder were carried out at various strain rates from 10−5 s−1 to 10−1 s−1 over a wide temperature range from −40°C to 125°C to study the effect of strain rate and testing temperature on the mechanical properties in a systematic manner. Based on these experimental data, a set of empirical formulae was derived by a statistical method to describe the effect of temperature and strain rate in a quantitative manner and explain the variation in the mechanical properties published in other reports. It is concluded that the empirical formulae can be used to characterize the mechanical properties of 63Sn/37Pb over a wide range of temperatures and strain rates. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy | |
| type | Journal Paper | |
| journal volume | 121 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792681 | |
| journal fristpage | 179 | |
| journal lastpage | 185 | |
| identifier eissn | 1043-7398 | |
| keywords | Temperature | |
| keywords | Alloys | |
| keywords | Solders | |
| keywords | Mechanical properties | |
| keywords | Formulas AND Testing | |
| tree | Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 003 | |
| contenttype | Fulltext | |
