| contributor author | T. Winkler | |
| contributor author | A. Schubert | |
| contributor author | E. Kaulfersch | |
| contributor author | B. Michel | |
| date accessioned | 2017-05-08T23:59:20Z | |
| date available | 2017-05-08T23:59:20Z | |
| date copyright | December, 1999 | |
| date issued | 1999 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26175#282_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/121986 | |
| description abstract | Much progress has been made in the simulation and verification of the thermo-mechanical behavior of plastic packages. On the other hand, until now there is a lack in the consideration of the scatter or uncertainty, respectively, of certain characteristics. A comparatively large scatter of local material properties or random geometrical imperfections can often be observed within the material compounds of electronic packages. The partial randomness of certain input parameters creates uncertainties in the finite element determination of mechanical quantities which are provided for thermo-mechanical reliability optimization and life time prediction. In the following the STOFEM stochastic finite element approach based on perturbation theory is applied as a part of the finite element simulation. It is used to find out some additional effects arising from uncertainties in the modeling, slightly varying parameters or probabilistic influences, respectively. In a second part of the paper, another approach to the consideration of random variations is discussed. It is based on the randomization of initially deterministic relations. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages | |
| type | Journal Paper | |
| journal volume | 121 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2793853 | |
| journal fristpage | 282 | |
| journal lastpage | 285 | |
| identifier eissn | 1043-7398 | |
| keywords | Reliability | |
| keywords | Simulation | |
| keywords | Radiation scattering | |
| keywords | Electromagnetic scattering | |
| keywords | Materials properties | |
| keywords | Finite element analysis | |
| keywords | Modeling | |
| keywords | Optimization | |
| keywords | Perturbation theory | |
| keywords | Electronic packages AND Uncertainty | |
| tree | Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 004 | |
| contenttype | Fulltext | |