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    Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 004::page 282
    Author:
    T. Winkler
    ,
    A. Schubert
    ,
    E. Kaulfersch
    ,
    B. Michel
    DOI: 10.1115/1.2793853
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Much progress has been made in the simulation and verification of the thermo-mechanical behavior of plastic packages. On the other hand, until now there is a lack in the consideration of the scatter or uncertainty, respectively, of certain characteristics. A comparatively large scatter of local material properties or random geometrical imperfections can often be observed within the material compounds of electronic packages. The partial randomness of certain input parameters creates uncertainties in the finite element determination of mechanical quantities which are provided for thermo-mechanical reliability optimization and life time prediction. In the following the STOFEM stochastic finite element approach based on perturbation theory is applied as a part of the finite element simulation. It is used to find out some additional effects arising from uncertainties in the modeling, slightly varying parameters or probabilistic influences, respectively. In a second part of the paper, another approach to the consideration of random variations is discussed. It is based on the randomization of initially deterministic relations.
    keyword(s): Reliability , Simulation , Radiation scattering , Electromagnetic scattering , Materials properties , Finite element analysis , Modeling , Optimization , Perturbation theory , Electronic packages AND Uncertainty ,
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      Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/121986
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    • Journal of Electronic Packaging

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    contributor authorT. Winkler
    contributor authorA. Schubert
    contributor authorE. Kaulfersch
    contributor authorB. Michel
    date accessioned2017-05-08T23:59:20Z
    date available2017-05-08T23:59:20Z
    date copyrightDecember, 1999
    date issued1999
    identifier issn1528-9044
    identifier otherJEPAE4-26175#282_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/121986
    description abstractMuch progress has been made in the simulation and verification of the thermo-mechanical behavior of plastic packages. On the other hand, until now there is a lack in the consideration of the scatter or uncertainty, respectively, of certain characteristics. A comparatively large scatter of local material properties or random geometrical imperfections can often be observed within the material compounds of electronic packages. The partial randomness of certain input parameters creates uncertainties in the finite element determination of mechanical quantities which are provided for thermo-mechanical reliability optimization and life time prediction. In the following the STOFEM stochastic finite element approach based on perturbation theory is applied as a part of the finite element simulation. It is used to find out some additional effects arising from uncertainties in the modeling, slightly varying parameters or probabilistic influences, respectively. In a second part of the paper, another approach to the consideration of random variations is discussed. It is based on the randomization of initially deterministic relations.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleConsideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages
    typeJournal Paper
    journal volume121
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2793853
    journal fristpage282
    journal lastpage285
    identifier eissn1043-7398
    keywordsReliability
    keywordsSimulation
    keywordsRadiation scattering
    keywordsElectromagnetic scattering
    keywordsMaterials properties
    keywordsFinite element analysis
    keywordsModeling
    keywordsOptimization
    keywordsPerturbation theory
    keywordsElectronic packages AND Uncertainty
    treeJournal of Electronic Packaging:;1999:;volume( 121 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian