Show simple item record

contributor authorT. Winkler
contributor authorA. Schubert
contributor authorE. Kaulfersch
contributor authorB. Michel
date accessioned2017-05-08T23:59:20Z
date available2017-05-08T23:59:20Z
date copyrightDecember, 1999
date issued1999
identifier issn1528-9044
identifier otherJEPAE4-26175#282_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/121986
description abstractMuch progress has been made in the simulation and verification of the thermo-mechanical behavior of plastic packages. On the other hand, until now there is a lack in the consideration of the scatter or uncertainty, respectively, of certain characteristics. A comparatively large scatter of local material properties or random geometrical imperfections can often be observed within the material compounds of electronic packages. The partial randomness of certain input parameters creates uncertainties in the finite element determination of mechanical quantities which are provided for thermo-mechanical reliability optimization and life time prediction. In the following the STOFEM stochastic finite element approach based on perturbation theory is applied as a part of the finite element simulation. It is used to find out some additional effects arising from uncertainties in the modeling, slightly varying parameters or probabilistic influences, respectively. In a second part of the paper, another approach to the consideration of random variations is discussed. It is based on the randomization of initially deterministic relations.
publisherThe American Society of Mechanical Engineers (ASME)
titleConsideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages
typeJournal Paper
journal volume121
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2793853
journal fristpage282
journal lastpage285
identifier eissn1043-7398
keywordsReliability
keywordsSimulation
keywordsRadiation scattering
keywordsElectromagnetic scattering
keywordsMaterials properties
keywordsFinite element analysis
keywordsModeling
keywordsOptimization
keywordsPerturbation theory
keywordsElectronic packages AND Uncertainty
treeJournal of Electronic Packaging:;1999:;volume( 121 ):;issue: 004
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record