Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property CharacterizationSource: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 003::page 275Author:H. Lu
DOI: 10.1115/1.2792633Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The method of digital speckle correlation is introduced, and so is the hardware system to implement the method. The advantages and the features of the technique are discussed, and application examples are given. Owing to the high spatial resolution that this technique can achieve, the method is especially useful in measuring small areas of an object, or a small component in an assembly, whether the surfaces under probing are planar or not. The applications have proved that the technique is a promising tool for the reliability study of microelectronic packages.
keyword(s): Manufacturing , Reliability , Hardware , Resolution (Optics) AND Strain measurement ,
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| contributor author | H. Lu | |
| date accessioned | 2017-05-08T23:56:15Z | |
| date available | 2017-05-08T23:56:15Z | |
| date copyright | September, 1998 | |
| date issued | 1998 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26167#275_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/120250 | |
| description abstract | The method of digital speckle correlation is introduced, and so is the hardware system to implement the method. The advantages and the features of the technique are discussed, and application examples are given. Owing to the high spatial resolution that this technique can achieve, the method is especially useful in measuring small areas of an object, or a small component in an assembly, whether the surfaces under probing are planar or not. The applications have proved that the technique is a promising tool for the reliability study of microelectronic packages. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization | |
| type | Journal Paper | |
| journal volume | 120 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792633 | |
| journal fristpage | 275 | |
| journal lastpage | 279 | |
| identifier eissn | 1043-7398 | |
| keywords | Manufacturing | |
| keywords | Reliability | |
| keywords | Hardware | |
| keywords | Resolution (Optics) AND Strain measurement | |
| tree | Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 003 | |
| contenttype | Fulltext |