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contributor authorH. Lu
date accessioned2017-05-08T23:56:15Z
date available2017-05-08T23:56:15Z
date copyrightSeptember, 1998
date issued1998
identifier issn1528-9044
identifier otherJEPAE4-26167#275_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/120250
description abstractThe method of digital speckle correlation is introduced, and so is the hardware system to implement the method. The advantages and the features of the technique are discussed, and application examples are given. Owing to the high spatial resolution that this technique can achieve, the method is especially useful in measuring small areas of an object, or a small component in an assembly, whether the surfaces under probing are planar or not. The applications have proved that the technique is a promising tool for the reliability study of microelectronic packages.
publisherThe American Society of Mechanical Engineers (ASME)
titleApplications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization
typeJournal Paper
journal volume120
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792633
journal fristpage275
journal lastpage279
identifier eissn1043-7398
keywordsManufacturing
keywordsReliability
keywordsHardware
keywordsResolution (Optics) AND Strain measurement
treeJournal of Electronic Packaging:;1998:;volume( 120 ):;issue: 003
contenttypeFulltext


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