contributor author | C. Basaran | |
contributor author | C.-Y. Yan | |
date accessioned | 2017-05-08T23:56:14Z | |
date available | 2017-05-08T23:56:14Z | |
date copyright | December, 1998 | |
date issued | 1998 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26169#379_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/120238 | |
description abstract | Damage mechanics describes the degradation process that takes place in materials and structures. Traditionally, Coffin–Manson type empirical curves are used to determine the fatigue life. Damage mechanics allows us to determine the fatigue life without the need for empirical curves. The main problem in damage mechanics has always been a lack of universally agreed upon definition of a damage metric. In this paper a damage metric based on the second law of thermodynamics and statistical mechanics is presented. The proposed thermodynamic framework treats a solid body as a thermodynamic system and requires that the entropy production be nonnegative. Verification of the damage model has been performed by extensive comparisons with laboratory test data of low cycle fatigue of Pb40/Sn60 solder alloy. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Thermodynamic Framework for Damage Mechanics of Solder Joints | |
type | Journal Paper | |
journal volume | 120 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792650 | |
journal fristpage | 379 | |
journal lastpage | 384 | |
identifier eissn | 1043-7398 | |
keywords | Statistical mechanics | |
keywords | Alloys | |
keywords | Solders | |
keywords | Entropy | |
keywords | Second law of thermodynamics | |
keywords | Thermal systems | |
keywords | Fatigue life | |
keywords | Low cycle fatigue AND Solder joints | |
tree | Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004 | |
contenttype | Fulltext | |