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contributor authorC. Basaran
contributor authorC.-Y. Yan
date accessioned2017-05-08T23:56:14Z
date available2017-05-08T23:56:14Z
date copyrightDecember, 1998
date issued1998
identifier issn1528-9044
identifier otherJEPAE4-26169#379_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/120238
description abstractDamage mechanics describes the degradation process that takes place in materials and structures. Traditionally, Coffin–Manson type empirical curves are used to determine the fatigue life. Damage mechanics allows us to determine the fatigue life without the need for empirical curves. The main problem in damage mechanics has always been a lack of universally agreed upon definition of a damage metric. In this paper a damage metric based on the second law of thermodynamics and statistical mechanics is presented. The proposed thermodynamic framework treats a solid body as a thermodynamic system and requires that the entropy production be nonnegative. Verification of the damage model has been performed by extensive comparisons with laboratory test data of low cycle fatigue of Pb40/Sn60 solder alloy.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Thermodynamic Framework for Damage Mechanics of Solder Joints
typeJournal Paper
journal volume120
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792650
journal fristpage379
journal lastpage384
identifier eissn1043-7398
keywordsStatistical mechanics
keywordsAlloys
keywordsSolders
keywordsEntropy
keywordsSecond law of thermodynamics
keywordsThermal systems
keywordsFatigue life
keywordsLow cycle fatigue AND Solder joints
treeJournal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004
contenttypeFulltext


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