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    A New Approach to Calculate Atomic Flux Divergence by Electromigration

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004::page 360
    Author:
    K. Sasagawa
    ,
    H. Abé
    ,
    N. Nakamura
    ,
    M. Saka
    DOI: 10.1115/1.2792647
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, a new calculation method of the atomic flux divergence used to predict the formation of electromigration-induced void is proposed by considering two-dimensional distributions of current density and temperature and also simply considering the line structure of not only polycrystalline, but also bamboo line. For the verification, electromigration phenomenon near the corner of an angled polycrystalline line, which results in two-dimensional distributions of current density and temperature, is treated as an example. The usefulness of the proposed method is discussed in the light of the comparison of prediction of void formation near the corner with the experimental result.
    keyword(s): Electrodiffusion , Corners (Structural elements) , Current density AND Temperature ,
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      A New Approach to Calculate Atomic Flux Divergence by Electromigration

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/120234
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    • Journal of Electronic Packaging

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    contributor authorK. Sasagawa
    contributor authorH. Abé
    contributor authorN. Nakamura
    contributor authorM. Saka
    date accessioned2017-05-08T23:56:13Z
    date available2017-05-08T23:56:13Z
    date copyrightDecember, 1998
    date issued1998
    identifier issn1528-9044
    identifier otherJEPAE4-26169#360_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/120234
    description abstractIn this paper, a new calculation method of the atomic flux divergence used to predict the formation of electromigration-induced void is proposed by considering two-dimensional distributions of current density and temperature and also simply considering the line structure of not only polycrystalline, but also bamboo line. For the verification, electromigration phenomenon near the corner of an angled polycrystalline line, which results in two-dimensional distributions of current density and temperature, is treated as an example. The usefulness of the proposed method is discussed in the light of the comparison of prediction of void formation near the corner with the experimental result.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA New Approach to Calculate Atomic Flux Divergence by Electromigration
    typeJournal Paper
    journal volume120
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792647
    journal fristpage360
    journal lastpage366
    identifier eissn1043-7398
    keywordsElectrodiffusion
    keywordsCorners (Structural elements)
    keywordsCurrent density AND Temperature
    treeJournal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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