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    Thermal Performance of Pin-Fin Fan-Sink Assemblies

    Source: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 001::page 26
    Author:
    R. A. Wirtz
    ,
    R. Sohal
    ,
    H. Wang
    DOI: 10.1115/1.2792197
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Experiments are reported on the thermal performance of model fan-sink assemblies consisting of a small axial flow fan which impinges air on a square array of pin-fins. Cylindrical, square, and diamond shape cross section pin-fins are considered. The pin-fin heat transfer coefficient is found to be maximum immediately under the fan blades and minimum below the fan hub and near the corners of the array. The overall heat sink thermal resistance, R , decreases with an increase in either applied pressure rise or fan power and fin height. At fixed applied pressure rise, R is minimized when the fin pitch-to-diameter ratiois maximum. At fixed fan power, R is minimized when the pitch-to-diameter ratio is reduced toward unity. Finally, cylindrical pin-fins give the best overall fan-sink performance.
    keyword(s): Pressure , Heat transfer , Pitch (Bituminous material) , Corners (Structural elements) , Axial flow , Blades , Diamonds , Fins , Heat sinks , Shapes AND Thermal resistance ,
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      Thermal Performance of Pin-Fin Fan-Sink Assemblies

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/118550
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    • Journal of Electronic Packaging

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    contributor authorR. A. Wirtz
    contributor authorR. Sohal
    contributor authorH. Wang
    date accessioned2017-05-08T23:53:13Z
    date available2017-05-08T23:53:13Z
    date copyrightMarch, 1997
    date issued1997
    identifier issn1528-9044
    identifier otherJEPAE4-26158#26_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/118550
    description abstractExperiments are reported on the thermal performance of model fan-sink assemblies consisting of a small axial flow fan which impinges air on a square array of pin-fins. Cylindrical, square, and diamond shape cross section pin-fins are considered. The pin-fin heat transfer coefficient is found to be maximum immediately under the fan blades and minimum below the fan hub and near the corners of the array. The overall heat sink thermal resistance, R , decreases with an increase in either applied pressure rise or fan power and fin height. At fixed applied pressure rise, R is minimized when the fin pitch-to-diameter ratiois maximum. At fixed fan power, R is minimized when the pitch-to-diameter ratio is reduced toward unity. Finally, cylindrical pin-fins give the best overall fan-sink performance.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Performance of Pin-Fin Fan-Sink Assemblies
    typeJournal Paper
    journal volume119
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792197
    journal fristpage26
    journal lastpage31
    identifier eissn1043-7398
    keywordsPressure
    keywordsHeat transfer
    keywordsPitch (Bituminous material)
    keywordsCorners (Structural elements)
    keywordsAxial flow
    keywordsBlades
    keywordsDiamonds
    keywordsFins
    keywordsHeat sinks
    keywordsShapes AND Thermal resistance
    treeJournal of Electronic Packaging:;1997:;volume( 119 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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