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contributor authorR. A. Wirtz
contributor authorR. Sohal
contributor authorH. Wang
date accessioned2017-05-08T23:53:13Z
date available2017-05-08T23:53:13Z
date copyrightMarch, 1997
date issued1997
identifier issn1528-9044
identifier otherJEPAE4-26158#26_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/118550
description abstractExperiments are reported on the thermal performance of model fan-sink assemblies consisting of a small axial flow fan which impinges air on a square array of pin-fins. Cylindrical, square, and diamond shape cross section pin-fins are considered. The pin-fin heat transfer coefficient is found to be maximum immediately under the fan blades and minimum below the fan hub and near the corners of the array. The overall heat sink thermal resistance, R , decreases with an increase in either applied pressure rise or fan power and fin height. At fixed applied pressure rise, R is minimized when the fin pitch-to-diameter ratiois maximum. At fixed fan power, R is minimized when the pitch-to-diameter ratio is reduced toward unity. Finally, cylindrical pin-fins give the best overall fan-sink performance.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Performance of Pin-Fin Fan-Sink Assemblies
typeJournal Paper
journal volume119
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792197
journal fristpage26
journal lastpage31
identifier eissn1043-7398
keywordsPressure
keywordsHeat transfer
keywordsPitch (Bituminous material)
keywordsCorners (Structural elements)
keywordsAxial flow
keywordsBlades
keywordsDiamonds
keywordsFins
keywordsHeat sinks
keywordsShapes AND Thermal resistance
treeJournal of Electronic Packaging:;1997:;volume( 119 ):;issue: 001
contenttypeFulltext


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