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    Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package

    Source: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 002::page 95
    Author:
    A. A. Watwe
    ,
    A. Bar-Cohen
    ,
    A. McNeil
    DOI: 10.1115/1.2792226
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study presents a detailed experimental investigation of the combined effects of pressure and subcooling on nucleate pool boiling and critical heat flux (CHF) for degassed fluorocarbon FC-72 boiling on a plastic pin-grid-array (PPGA) chip package. In these experiments pressure was varied between 101.3 and 303.9 kPa and the subcooling ranged from 0 to 65°C. As expected, lower wall superheats resulted from increases in pressure, while subcooling had a minimal effect on fully developed pool boiling. However, the superheat reductions and CHF enhancements were found to be smaller than those predicted by existing models. The CHF for saturated liquid conditions increased by nearly 17 percent for an increase in pressure from 101.3 to 202.7 kPa. In experiments with both FC-72 and FC-87 further increases in pressure did not produce any significant increase in CHF. At a pressure of 101.3 kPa a subcooling of 30°C increased CHF on horizontal upward-facing chips by approximately 50 percent, as compared to 70 percent on vertically oriented packages. The enhancement in CHF due to subcooling decreased rapidly with increasing pressure, and the data showed that the influence of pressure and subcooling on CHF is not additive. A correlation to predict pool boiling CHF under the combined effects of pressure and subcooling is proposed.
    keyword(s): Pressure , Integrated circuits , Pool boiling AND Subcooling ,
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      Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package

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    contributor authorA. A. Watwe
    contributor authorA. Bar-Cohen
    contributor authorA. McNeil
    date accessioned2017-05-08T23:53:13Z
    date available2017-05-08T23:53:13Z
    date copyrightJune, 1997
    date issued1997
    identifier issn1528-9044
    identifier otherJEPAE4-26160#95_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/118538
    description abstractThis study presents a detailed experimental investigation of the combined effects of pressure and subcooling on nucleate pool boiling and critical heat flux (CHF) for degassed fluorocarbon FC-72 boiling on a plastic pin-grid-array (PPGA) chip package. In these experiments pressure was varied between 101.3 and 303.9 kPa and the subcooling ranged from 0 to 65°C. As expected, lower wall superheats resulted from increases in pressure, while subcooling had a minimal effect on fully developed pool boiling. However, the superheat reductions and CHF enhancements were found to be smaller than those predicted by existing models. The CHF for saturated liquid conditions increased by nearly 17 percent for an increase in pressure from 101.3 to 202.7 kPa. In experiments with both FC-72 and FC-87 further increases in pressure did not produce any significant increase in CHF. At a pressure of 101.3 kPa a subcooling of 30°C increased CHF on horizontal upward-facing chips by approximately 50 percent, as compared to 70 percent on vertically oriented packages. The enhancement in CHF due to subcooling decreased rapidly with increasing pressure, and the data showed that the influence of pressure and subcooling on CHF is not additive. A correlation to predict pool boiling CHF under the combined effects of pressure and subcooling is proposed.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleCombined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package
    typeJournal Paper
    journal volume119
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792226
    journal fristpage95
    journal lastpage105
    identifier eissn1043-7398
    keywordsPressure
    keywordsIntegrated circuits
    keywordsPool boiling AND Subcooling
    treeJournal of Electronic Packaging:;1997:;volume( 119 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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