contributor author | A. A. Watwe | |
contributor author | A. Bar-Cohen | |
contributor author | A. McNeil | |
date accessioned | 2017-05-08T23:53:13Z | |
date available | 2017-05-08T23:53:13Z | |
date copyright | June, 1997 | |
date issued | 1997 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26160#95_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118538 | |
description abstract | This study presents a detailed experimental investigation of the combined effects of pressure and subcooling on nucleate pool boiling and critical heat flux (CHF) for degassed fluorocarbon FC-72 boiling on a plastic pin-grid-array (PPGA) chip package. In these experiments pressure was varied between 101.3 and 303.9 kPa and the subcooling ranged from 0 to 65°C. As expected, lower wall superheats resulted from increases in pressure, while subcooling had a minimal effect on fully developed pool boiling. However, the superheat reductions and CHF enhancements were found to be smaller than those predicted by existing models. The CHF for saturated liquid conditions increased by nearly 17 percent for an increase in pressure from 101.3 to 202.7 kPa. In experiments with both FC-72 and FC-87 further increases in pressure did not produce any significant increase in CHF. At a pressure of 101.3 kPa a subcooling of 30°C increased CHF on horizontal upward-facing chips by approximately 50 percent, as compared to 70 percent on vertically oriented packages. The enhancement in CHF due to subcooling decreased rapidly with increasing pressure, and the data showed that the influence of pressure and subcooling on CHF is not additive. A correlation to predict pool boiling CHF under the combined effects of pressure and subcooling is proposed. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package | |
type | Journal Paper | |
journal volume | 119 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792226 | |
journal fristpage | 95 | |
journal lastpage | 105 | |
identifier eissn | 1043-7398 | |
keywords | Pressure | |
keywords | Integrated circuits | |
keywords | Pool boiling AND Subcooling | |
tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 002 | |
contenttype | Fulltext | |