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contributor authorA. A. Watwe
contributor authorA. Bar-Cohen
contributor authorA. McNeil
date accessioned2017-05-08T23:53:13Z
date available2017-05-08T23:53:13Z
date copyrightJune, 1997
date issued1997
identifier issn1528-9044
identifier otherJEPAE4-26160#95_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/118538
description abstractThis study presents a detailed experimental investigation of the combined effects of pressure and subcooling on nucleate pool boiling and critical heat flux (CHF) for degassed fluorocarbon FC-72 boiling on a plastic pin-grid-array (PPGA) chip package. In these experiments pressure was varied between 101.3 and 303.9 kPa and the subcooling ranged from 0 to 65°C. As expected, lower wall superheats resulted from increases in pressure, while subcooling had a minimal effect on fully developed pool boiling. However, the superheat reductions and CHF enhancements were found to be smaller than those predicted by existing models. The CHF for saturated liquid conditions increased by nearly 17 percent for an increase in pressure from 101.3 to 202.7 kPa. In experiments with both FC-72 and FC-87 further increases in pressure did not produce any significant increase in CHF. At a pressure of 101.3 kPa a subcooling of 30°C increased CHF on horizontal upward-facing chips by approximately 50 percent, as compared to 70 percent on vertically oriented packages. The enhancement in CHF due to subcooling decreased rapidly with increasing pressure, and the data showed that the influence of pressure and subcooling on CHF is not additive. A correlation to predict pool boiling CHF under the combined effects of pressure and subcooling is proposed.
publisherThe American Society of Mechanical Engineers (ASME)
titleCombined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package
typeJournal Paper
journal volume119
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792226
journal fristpage95
journal lastpage105
identifier eissn1043-7398
keywordsPressure
keywordsIntegrated circuits
keywordsPool boiling AND Subcooling
treeJournal of Electronic Packaging:;1997:;volume( 119 ):;issue: 002
contenttypeFulltext


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