contributor author | R. C. Dunne | |
contributor author | S. K. Sitaraman | |
date accessioned | 2017-05-08T23:53:12Z | |
date available | 2017-05-08T23:53:12Z | |
date copyright | September, 1997 | |
date issued | 1997 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26161#197_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118529 | |
description abstract | The thermomechanical behavior of a new multilayered substrate with embedded passive components is the focus of this study. Such structures are typically susceptible to localized interfacial stresses near the free edge, which might initiate delamination and subsequent failure of the electronic component. The effect of some key parameters—base layer material, interlayer dielectric material, base layer thickness, and temperature range—on substrate warpage and interfacial shear and peel stress distribution is presented. Material and design recommendations for improved thermomechanical response are suggested based on this initial parametric study. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM) | |
type | Journal Paper | |
journal volume | 119 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792234 | |
journal fristpage | 197 | |
journal lastpage | 203 | |
identifier eissn | 1043-7398 | |
keywords | Stress concentration AND Warping | |
tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 003 | |
contenttype | Fulltext | |