Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)

Abstract

The thermomechanical behavior of a new multilayered substrate with embedded passive components is the focus of this study. Such structures are typically susceptible to localized interfacial stresses near the free edge, which might initiate delamination and subsequent failure of the electronic component. The effect of some key parameters—base layer material, interlayer dielectric material, base layer thickness, and temperature range—on substrate warpage and interfacial shear and peel stress distribution is presented. Material and design recommendations for improved thermomechanical response are suggested based on this initial parametric study.