Gull-Wing Solder Joint Fatigue Life Sensitivity EvaluationSource: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 003::page 171DOI: 10.1115/1.2792230Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A Taguchi design of experiment approach was applied to thermostructural analyses of a gull-wing solder joint assembly. This approach uses a minimum number of finite element analyses to evaluate the impact of solder joint assembly parameters on fatigue life of the assembly. To avoid costly complex modeling efforts for each parametric case study, a commercially available program, MSC/PATRAN’s PATRAN Command Language, was used to automatically create finite element models of a two-dimensional gull-wing solder joint assembly based on nine parameters. Modeling time was dramatically reduced from days to a few minutes for each detailed lead/solder model. Two sets of parametric studies were conducted to evaluate the impact of variation of the six parameters. The analysis results indicate that lead ankle radius is the most critical parameter affecting solder joint total fatigue life, and lead and minimum solder thicknesses are the next most critical ones. Therefore, to effectively improve the solder joint fatigue life margin, it is recommended to: (1) increase the minimum solder thickness; (2) use thinner lead; and (3) use a larger lead ankle radius, even though this may require reducing lead shin length. By implementing only the last recommendation to modify the current solder joint assembly, the fatigue life margin in this design could, in general, be improved by 27 percent or more.
keyword(s): Fatigue life , Solder joints AND Wings ,
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contributor author | T. E. Wong | |
contributor author | B. D. Tierney | |
contributor author | L. A. Kachatorian | |
date accessioned | 2017-05-08T23:53:12Z | |
date available | 2017-05-08T23:53:12Z | |
date copyright | September, 1997 | |
date issued | 1997 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26161#171_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118525 | |
description abstract | A Taguchi design of experiment approach was applied to thermostructural analyses of a gull-wing solder joint assembly. This approach uses a minimum number of finite element analyses to evaluate the impact of solder joint assembly parameters on fatigue life of the assembly. To avoid costly complex modeling efforts for each parametric case study, a commercially available program, MSC/PATRAN’s PATRAN Command Language, was used to automatically create finite element models of a two-dimensional gull-wing solder joint assembly based on nine parameters. Modeling time was dramatically reduced from days to a few minutes for each detailed lead/solder model. Two sets of parametric studies were conducted to evaluate the impact of variation of the six parameters. The analysis results indicate that lead ankle radius is the most critical parameter affecting solder joint total fatigue life, and lead and minimum solder thicknesses are the next most critical ones. Therefore, to effectively improve the solder joint fatigue life margin, it is recommended to: (1) increase the minimum solder thickness; (2) use thinner lead; and (3) use a larger lead ankle radius, even though this may require reducing lead shin length. By implementing only the last recommendation to modify the current solder joint assembly, the fatigue life margin in this design could, in general, be improved by 27 percent or more. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Gull-Wing Solder Joint Fatigue Life Sensitivity Evaluation | |
type | Journal Paper | |
journal volume | 119 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792230 | |
journal fristpage | 171 | |
journal lastpage | 176 | |
identifier eissn | 1043-7398 | |
keywords | Fatigue life | |
keywords | Solder joints AND Wings | |
tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 003 | |
contenttype | Fulltext |