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contributor authorT. E. Wong
contributor authorB. D. Tierney
contributor authorL. A. Kachatorian
date accessioned2017-05-08T23:53:12Z
date available2017-05-08T23:53:12Z
date copyrightSeptember, 1997
date issued1997
identifier issn1528-9044
identifier otherJEPAE4-26161#171_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/118525
description abstractA Taguchi design of experiment approach was applied to thermostructural analyses of a gull-wing solder joint assembly. This approach uses a minimum number of finite element analyses to evaluate the impact of solder joint assembly parameters on fatigue life of the assembly. To avoid costly complex modeling efforts for each parametric case study, a commercially available program, MSC/PATRAN’s PATRAN Command Language, was used to automatically create finite element models of a two-dimensional gull-wing solder joint assembly based on nine parameters. Modeling time was dramatically reduced from days to a few minutes for each detailed lead/solder model. Two sets of parametric studies were conducted to evaluate the impact of variation of the six parameters. The analysis results indicate that lead ankle radius is the most critical parameter affecting solder joint total fatigue life, and lead and minimum solder thicknesses are the next most critical ones. Therefore, to effectively improve the solder joint fatigue life margin, it is recommended to: (1) increase the minimum solder thickness; (2) use thinner lead; and (3) use a larger lead ankle radius, even though this may require reducing lead shin length. By implementing only the last recommendation to modify the current solder joint assembly, the fatigue life margin in this design could, in general, be improved by 27 percent or more.
publisherThe American Society of Mechanical Engineers (ASME)
titleGull-Wing Solder Joint Fatigue Life Sensitivity Evaluation
typeJournal Paper
journal volume119
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792230
journal fristpage171
journal lastpage176
identifier eissn1043-7398
keywordsFatigue life
keywordsSolder joints AND Wings
treeJournal of Electronic Packaging:;1997:;volume( 119 ):;issue: 003
contenttypeFulltext


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