| contributor author | J. W. Tierney | |
| contributor author | J. W. Eischen | |
| date accessioned | 2017-05-08T23:53:09Z | |
| date available | 2017-05-08T23:53:09Z | |
| date copyright | December, 1997 | |
| date issued | 1997 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26163#281_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/118515 | |
| description abstract | The residual stress distribution in bimaterial beams induced by multiple thermal loadings has been investigated. Three models for the nonlinear stress-strain material behavior were considered: bilinear elastic-plastic, power law elastic-plastic, and power law purely plastic. The equations governing equilibrium, compatibility of strain, and stress-strain for the bimaterial configuration make up a system of nonlinear algebraic equations which is solved numerically. The elastic-plastic power law model leads to stress discontinuity in the layers. The other two models have been verified with a finite element analysis. Several examples are included using materials common to the microelectronics industry. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading | |
| type | Journal Paper | |
| journal volume | 119 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792250 | |
| journal fristpage | 281 | |
| journal lastpage | 287 | |
| identifier eissn | 1043-7398 | |
| keywords | Stress analysis (Engineering) | |
| keywords | Strips | |
| keywords | Stress | |
| keywords | Equations | |
| keywords | Stress concentration | |
| keywords | Finite element analysis | |
| keywords | Microelectronic devices AND Equilibrium (Physics) | |
| tree | Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 004 | |
| contenttype | Fulltext | |