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contributor authorJ. W. Tierney
contributor authorJ. W. Eischen
date accessioned2017-05-08T23:53:09Z
date available2017-05-08T23:53:09Z
date copyrightDecember, 1997
date issued1997
identifier issn1528-9044
identifier otherJEPAE4-26163#281_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/118515
description abstractThe residual stress distribution in bimaterial beams induced by multiple thermal loadings has been investigated. Three models for the nonlinear stress-strain material behavior were considered: bilinear elastic-plastic, power law elastic-plastic, and power law purely plastic. The equations governing equilibrium, compatibility of strain, and stress-strain for the bimaterial configuration make up a system of nonlinear algebraic equations which is solved numerically. The elastic-plastic power law model leads to stress discontinuity in the layers. The other two models have been verified with a finite element analysis. Several examples are included using materials common to the microelectronics industry.
publisherThe American Society of Mechanical Engineers (ASME)
titleResidual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading
typeJournal Paper
journal volume119
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792250
journal fristpage281
journal lastpage287
identifier eissn1043-7398
keywordsStress analysis (Engineering)
keywordsStrips
keywordsStress
keywordsEquations
keywordsStress concentration
keywordsFinite element analysis
keywordsMicroelectronic devices AND Equilibrium (Physics)
treeJournal of Electronic Packaging:;1997:;volume( 119 ):;issue: 004
contenttypeFulltext


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