Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet ImpingementSource: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 001::page 21Author:David Copeland
DOI: 10.1115/1.2792122Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experimental measurements of multiple nozzle submerged jet array impingement single-phase and boiling heat transfer were made using FC-72 and 1 cm square copper pin fin arrays, having equal width and spacing of 0.1 and 0.2 mm, with aspect ratios from 1 to 5. Arrays of 25 and 100 nozzles were used, with diameters of 0.25 to 1.0 mm providing nozzle area from 5 to 20 mm2 (5 to 20% of the heat source base area). Flow rates of 2.5 to 10 cm3 /s (0.15 to 0.6 l/min) were studied, with nozzle velocities from 0.125 to 2 m/s. Single nozzles and smooth surfaces were also evaluated for comparison. Single-phase heat transfer coefficients (based on planform area) from 2.4 to 49.3 kW/m2 K were measured, while critical heat flux varied from 45 to 395 W/cm2 . Correlations of the single-phase heat transfer coefficient and critical heat flux as functions of pin fin dimensions, number of nozzles, nozzle area and liquid flow rate are provided.
keyword(s): Cooling , Boiling , Nozzles , Flow (Dynamics) , Heat transfer coefficients , Critical heat flux , Heat , Heat transfer , Functions , Copper , Measurement AND Dimensions ,
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| contributor author | David Copeland | |
| date accessioned | 2017-05-08T23:49:51Z | |
| date available | 2017-05-08T23:49:51Z | |
| date copyright | March, 1996 | |
| date issued | 1996 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26153#21_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116801 | |
| description abstract | Experimental measurements of multiple nozzle submerged jet array impingement single-phase and boiling heat transfer were made using FC-72 and 1 cm square copper pin fin arrays, having equal width and spacing of 0.1 and 0.2 mm, with aspect ratios from 1 to 5. Arrays of 25 and 100 nozzles were used, with diameters of 0.25 to 1.0 mm providing nozzle area from 5 to 20 mm2 (5 to 20% of the heat source base area). Flow rates of 2.5 to 10 cm3 /s (0.15 to 0.6 l/min) were studied, with nozzle velocities from 0.125 to 2 m/s. Single nozzles and smooth surfaces were also evaluated for comparison. Single-phase heat transfer coefficients (based on planform area) from 2.4 to 49.3 kW/m2 K were measured, while critical heat flux varied from 45 to 395 W/cm2 . Correlations of the single-phase heat transfer coefficient and critical heat flux as functions of pin fin dimensions, number of nozzles, nozzle area and liquid flow rate are provided. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement | |
| type | Journal Paper | |
| journal volume | 118 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792122 | |
| journal fristpage | 21 | |
| journal lastpage | 26 | |
| identifier eissn | 1043-7398 | |
| keywords | Cooling | |
| keywords | Boiling | |
| keywords | Nozzles | |
| keywords | Flow (Dynamics) | |
| keywords | Heat transfer coefficients | |
| keywords | Critical heat flux | |
| keywords | Heat | |
| keywords | Heat transfer | |
| keywords | Functions | |
| keywords | Copper | |
| keywords | Measurement AND Dimensions | |
| tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 001 | |
| contenttype | Fulltext |