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    Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement

    Source: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 001::page 21
    Author:
    David Copeland
    DOI: 10.1115/1.2792122
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Experimental measurements of multiple nozzle submerged jet array impingement single-phase and boiling heat transfer were made using FC-72 and 1 cm square copper pin fin arrays, having equal width and spacing of 0.1 and 0.2 mm, with aspect ratios from 1 to 5. Arrays of 25 and 100 nozzles were used, with diameters of 0.25 to 1.0 mm providing nozzle area from 5 to 20 mm2 (5 to 20% of the heat source base area). Flow rates of 2.5 to 10 cm3 /s (0.15 to 0.6 l/min) were studied, with nozzle velocities from 0.125 to 2 m/s. Single nozzles and smooth surfaces were also evaluated for comparison. Single-phase heat transfer coefficients (based on planform area) from 2.4 to 49.3 kW/m2 K were measured, while critical heat flux varied from 45 to 395 W/cm2 . Correlations of the single-phase heat transfer coefficient and critical heat flux as functions of pin fin dimensions, number of nozzles, nozzle area and liquid flow rate are provided.
    keyword(s): Cooling , Boiling , Nozzles , Flow (Dynamics) , Heat transfer coefficients , Critical heat flux , Heat , Heat transfer , Functions , Copper , Measurement AND Dimensions ,
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      Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement

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    http://yetl.yabesh.ir/yetl1/handle/yetl/116801
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    contributor authorDavid Copeland
    date accessioned2017-05-08T23:49:51Z
    date available2017-05-08T23:49:51Z
    date copyrightMarch, 1996
    date issued1996
    identifier issn1528-9044
    identifier otherJEPAE4-26153#21_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/116801
    description abstractExperimental measurements of multiple nozzle submerged jet array impingement single-phase and boiling heat transfer were made using FC-72 and 1 cm square copper pin fin arrays, having equal width and spacing of 0.1 and 0.2 mm, with aspect ratios from 1 to 5. Arrays of 25 and 100 nozzles were used, with diameters of 0.25 to 1.0 mm providing nozzle area from 5 to 20 mm2 (5 to 20% of the heat source base area). Flow rates of 2.5 to 10 cm3 /s (0.15 to 0.6 l/min) were studied, with nozzle velocities from 0.125 to 2 m/s. Single nozzles and smooth surfaces were also evaluated for comparison. Single-phase heat transfer coefficients (based on planform area) from 2.4 to 49.3 kW/m2 K were measured, while critical heat flux varied from 45 to 395 W/cm2 . Correlations of the single-phase heat transfer coefficient and critical heat flux as functions of pin fin dimensions, number of nozzles, nozzle area and liquid flow rate are provided.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleSingle-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement
    typeJournal Paper
    journal volume118
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792122
    journal fristpage21
    journal lastpage26
    identifier eissn1043-7398
    keywordsCooling
    keywordsBoiling
    keywordsNozzles
    keywordsFlow (Dynamics)
    keywordsHeat transfer coefficients
    keywordsCritical heat flux
    keywordsHeat
    keywordsHeat transfer
    keywordsFunctions
    keywordsCopper
    keywordsMeasurement AND Dimensions
    treeJournal of Electronic Packaging:;1996:;volume( 118 ):;issue: 001
    contenttypeFulltext
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