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contributor authorDavid Copeland
date accessioned2017-05-08T23:49:51Z
date available2017-05-08T23:49:51Z
date copyrightMarch, 1996
date issued1996
identifier issn1528-9044
identifier otherJEPAE4-26153#21_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/116801
description abstractExperimental measurements of multiple nozzle submerged jet array impingement single-phase and boiling heat transfer were made using FC-72 and 1 cm square copper pin fin arrays, having equal width and spacing of 0.1 and 0.2 mm, with aspect ratios from 1 to 5. Arrays of 25 and 100 nozzles were used, with diameters of 0.25 to 1.0 mm providing nozzle area from 5 to 20 mm2 (5 to 20% of the heat source base area). Flow rates of 2.5 to 10 cm3 /s (0.15 to 0.6 l/min) were studied, with nozzle velocities from 0.125 to 2 m/s. Single nozzles and smooth surfaces were also evaluated for comparison. Single-phase heat transfer coefficients (based on planform area) from 2.4 to 49.3 kW/m2 K were measured, while critical heat flux varied from 45 to 395 W/cm2 . Correlations of the single-phase heat transfer coefficient and critical heat flux as functions of pin fin dimensions, number of nozzles, nozzle area and liquid flow rate are provided.
publisherThe American Society of Mechanical Engineers (ASME)
titleSingle-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement
typeJournal Paper
journal volume118
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792122
journal fristpage21
journal lastpage26
identifier eissn1043-7398
keywordsCooling
keywordsBoiling
keywordsNozzles
keywordsFlow (Dynamics)
keywordsHeat transfer coefficients
keywordsCritical heat flux
keywordsHeat
keywordsHeat transfer
keywordsFunctions
keywordsCopper
keywordsMeasurement AND Dimensions
treeJournal of Electronic Packaging:;1996:;volume( 118 ):;issue: 001
contenttypeFulltext


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