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    Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

    Source: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003::page 164
    Author:
    Hiromasa Ishikawa
    ,
    Katsuhiko Sasaki
    ,
    Ken-ichi Ohguchi
    DOI: 10.1115/1.2792147
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper treats the prediction of fatigue life of 60Sn-40Pb solder alloy using the plastic strain work density per unit time calculated from the proposed constitutive model for cyclic viscoplasticity. At first, in order to verify the applicability of the proposed constitutive model to the deformation of 60Sn-40Pb solder alloy, a series of basic experiments, such as creep tests and cyclic tension-compression loading tests are performed at 303K, 323K, 343K. Then, the proposed constitutive model is used to predict fatigue failure of the solder alloy. As a result, it is clarified that the proposed constitutive model is applicable to explain the viscous deformation of the solder alloy, and that its fatigue failure can be predicted using the plastic strain work density per unit time.
    keyword(s): Fatigue , Solders AND Failure ,
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      Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/116779
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    • Journal of Electronic Packaging

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    contributor authorHiromasa Ishikawa
    contributor authorKatsuhiko Sasaki
    contributor authorKen-ichi Ohguchi
    date accessioned2017-05-08T23:49:49Z
    date available2017-05-08T23:49:49Z
    date copyrightSeptember, 1996
    date issued1996
    identifier issn1528-9044
    identifier otherJEPAE4-26155#164_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/116779
    description abstractThis paper treats the prediction of fatigue life of 60Sn-40Pb solder alloy using the plastic strain work density per unit time calculated from the proposed constitutive model for cyclic viscoplasticity. At first, in order to verify the applicability of the proposed constitutive model to the deformation of 60Sn-40Pb solder alloy, a series of basic experiments, such as creep tests and cyclic tension-compression loading tests are performed at 303K, 323K, 343K. Then, the proposed constitutive model is used to predict fatigue failure of the solder alloy. As a result, it is clarified that the proposed constitutive model is applicable to explain the viscous deformation of the solder alloy, and that its fatigue failure can be predicted using the plastic strain work density per unit time.
    publisherThe American Society of Mechanical Engineers (ASME)
    titlePrediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity
    typeJournal Paper
    journal volume118
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792147
    journal fristpage164
    journal lastpage169
    identifier eissn1043-7398
    keywordsFatigue
    keywordsSolders AND Failure
    treeJournal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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