Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic ViscoplasticitySource: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003::page 164DOI: 10.1115/1.2792147Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper treats the prediction of fatigue life of 60Sn-40Pb solder alloy using the plastic strain work density per unit time calculated from the proposed constitutive model for cyclic viscoplasticity. At first, in order to verify the applicability of the proposed constitutive model to the deformation of 60Sn-40Pb solder alloy, a series of basic experiments, such as creep tests and cyclic tension-compression loading tests are performed at 303K, 323K, 343K. Then, the proposed constitutive model is used to predict fatigue failure of the solder alloy. As a result, it is clarified that the proposed constitutive model is applicable to explain the viscous deformation of the solder alloy, and that its fatigue failure can be predicted using the plastic strain work density per unit time.
keyword(s): Fatigue , Solders AND Failure ,
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contributor author | Hiromasa Ishikawa | |
contributor author | Katsuhiko Sasaki | |
contributor author | Ken-ichi Ohguchi | |
date accessioned | 2017-05-08T23:49:49Z | |
date available | 2017-05-08T23:49:49Z | |
date copyright | September, 1996 | |
date issued | 1996 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26155#164_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116779 | |
description abstract | This paper treats the prediction of fatigue life of 60Sn-40Pb solder alloy using the plastic strain work density per unit time calculated from the proposed constitutive model for cyclic viscoplasticity. At first, in order to verify the applicability of the proposed constitutive model to the deformation of 60Sn-40Pb solder alloy, a series of basic experiments, such as creep tests and cyclic tension-compression loading tests are performed at 303K, 323K, 343K. Then, the proposed constitutive model is used to predict fatigue failure of the solder alloy. As a result, it is clarified that the proposed constitutive model is applicable to explain the viscous deformation of the solder alloy, and that its fatigue failure can be predicted using the plastic strain work density per unit time. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity | |
type | Journal Paper | |
journal volume | 118 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792147 | |
journal fristpage | 164 | |
journal lastpage | 169 | |
identifier eissn | 1043-7398 | |
keywords | Fatigue | |
keywords | Solders AND Failure | |
tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003 | |
contenttype | Fulltext |