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contributor authorHiromasa Ishikawa
contributor authorKatsuhiko Sasaki
contributor authorKen-ichi Ohguchi
date accessioned2017-05-08T23:49:49Z
date available2017-05-08T23:49:49Z
date copyrightSeptember, 1996
date issued1996
identifier issn1528-9044
identifier otherJEPAE4-26155#164_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/116779
description abstractThis paper treats the prediction of fatigue life of 60Sn-40Pb solder alloy using the plastic strain work density per unit time calculated from the proposed constitutive model for cyclic viscoplasticity. At first, in order to verify the applicability of the proposed constitutive model to the deformation of 60Sn-40Pb solder alloy, a series of basic experiments, such as creep tests and cyclic tension-compression loading tests are performed at 303K, 323K, 343K. Then, the proposed constitutive model is used to predict fatigue failure of the solder alloy. As a result, it is clarified that the proposed constitutive model is applicable to explain the viscous deformation of the solder alloy, and that its fatigue failure can be predicted using the plastic strain work density per unit time.
publisherThe American Society of Mechanical Engineers (ASME)
titlePrediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity
typeJournal Paper
journal volume118
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792147
journal fristpage164
journal lastpage169
identifier eissn1043-7398
keywordsFatigue
keywordsSolders AND Failure
treeJournal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003
contenttypeFulltext


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