The Thermal Wake Function for Rectangular Electronic ModulesSource: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 001::page 55Author:S. S. Kang
DOI: 10.1115/1.2905494Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A point heat source model is employed to study the thermal wake function for an array of rectangular electronic modules situated in a uniform flow stream. For the particular case of in-line modules, a simple equation for the wake function is developed in terms of a modified Peclet number. The length scale for the Peclet number is the square of the module width divided by the streamwise spacing of the modules. The downstream decay of the wake function is shown to be well represented by a power law. Sample calculations using the present model are shown to compare well with experimental data for laminar as well as turbulent flows.
keyword(s): Wakes , Equations , Flow (Dynamics) , Heat AND Turbulence ,
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contributor author | S. S. Kang | |
date accessioned | 2017-05-08T23:43:59Z | |
date available | 2017-05-08T23:43:59Z | |
date copyright | March, 1994 | |
date issued | 1994 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26141#55_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113462 | |
description abstract | A point heat source model is employed to study the thermal wake function for an array of rectangular electronic modules situated in a uniform flow stream. For the particular case of in-line modules, a simple equation for the wake function is developed in terms of a modified Peclet number. The length scale for the Peclet number is the square of the module width divided by the streamwise spacing of the modules. The downstream decay of the wake function is shown to be well represented by a power law. Sample calculations using the present model are shown to compare well with experimental data for laminar as well as turbulent flows. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | The Thermal Wake Function for Rectangular Electronic Modules | |
type | Journal Paper | |
journal volume | 116 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2905494 | |
journal fristpage | 55 | |
journal lastpage | 59 | |
identifier eissn | 1043-7398 | |
keywords | Wakes | |
keywords | Equations | |
keywords | Flow (Dynamics) | |
keywords | Heat AND Turbulence | |
tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 001 | |
contenttype | Fulltext |