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    The Thermal Wake Function for Rectangular Electronic Modules

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 001::page 55
    Author:
    S. S. Kang
    DOI: 10.1115/1.2905494
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A point heat source model is employed to study the thermal wake function for an array of rectangular electronic modules situated in a uniform flow stream. For the particular case of in-line modules, a simple equation for the wake function is developed in terms of a modified Peclet number. The length scale for the Peclet number is the square of the module width divided by the streamwise spacing of the modules. The downstream decay of the wake function is shown to be well represented by a power law. Sample calculations using the present model are shown to compare well with experimental data for laminar as well as turbulent flows.
    keyword(s): Wakes , Equations , Flow (Dynamics) , Heat AND Turbulence ,
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      The Thermal Wake Function for Rectangular Electronic Modules

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    http://yetl.yabesh.ir/yetl1/handle/yetl/113462
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    contributor authorS. S. Kang
    date accessioned2017-05-08T23:43:59Z
    date available2017-05-08T23:43:59Z
    date copyrightMarch, 1994
    date issued1994
    identifier issn1528-9044
    identifier otherJEPAE4-26141#55_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/113462
    description abstractA point heat source model is employed to study the thermal wake function for an array of rectangular electronic modules situated in a uniform flow stream. For the particular case of in-line modules, a simple equation for the wake function is developed in terms of a modified Peclet number. The length scale for the Peclet number is the square of the module width divided by the streamwise spacing of the modules. The downstream decay of the wake function is shown to be well represented by a power law. Sample calculations using the present model are shown to compare well with experimental data for laminar as well as turbulent flows.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThe Thermal Wake Function for Rectangular Electronic Modules
    typeJournal Paper
    journal volume116
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905494
    journal fristpage55
    journal lastpage59
    identifier eissn1043-7398
    keywordsWakes
    keywordsEquations
    keywordsFlow (Dynamics)
    keywordsHeat AND Turbulence
    treeJournal of Electronic Packaging:;1994:;volume( 116 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian