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contributor authorS. S. Kang
date accessioned2017-05-08T23:43:59Z
date available2017-05-08T23:43:59Z
date copyrightMarch, 1994
date issued1994
identifier issn1528-9044
identifier otherJEPAE4-26141#55_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/113462
description abstractA point heat source model is employed to study the thermal wake function for an array of rectangular electronic modules situated in a uniform flow stream. For the particular case of in-line modules, a simple equation for the wake function is developed in terms of a modified Peclet number. The length scale for the Peclet number is the square of the module width divided by the streamwise spacing of the modules. The downstream decay of the wake function is shown to be well represented by a power law. Sample calculations using the present model are shown to compare well with experimental data for laminar as well as turbulent flows.
publisherThe American Society of Mechanical Engineers (ASME)
titleThe Thermal Wake Function for Rectangular Electronic Modules
typeJournal Paper
journal volume116
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2905494
journal fristpage55
journal lastpage59
identifier eissn1043-7398
keywordsWakes
keywordsEquations
keywordsFlow (Dynamics)
keywordsHeat AND Turbulence
treeJournal of Electronic Packaging:;1994:;volume( 116 ):;issue: 001
contenttypeFulltext


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